參數(shù)資料
型號(hào): EN5365QI
廠商: ENPIRION INC
元件分類: 穩(wěn)壓器
中文描述: SWITCHING REGULATOR, 5000 kHz SWITCHING FREQ-MAX, QCC58
封裝: HALOGEN FREE AND ROHS COMPLIANT, QFN-58
文件頁(yè)數(shù): 6/17頁(yè)
文件大?。?/td> 825K
代理商: EN5365QI
03816
9/18/2009
Rev:B
EN5365QI
Enpirion 2009 all rights reserved, E&OE
www.enpirion.com
Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom Of Package
Lead frame offers many advantages in thermal performance, in reduced electrical lead resistance, ,
and in overall foot print. However, they do require some special considerations.
In the assembly process lead frame construction requires that, for mechanical support, some of the
lead-frame cantilevers be exposed at the point where wire-bond or internal passives are attached.
This results in several small pads being exposed on the bottom of the package.
Only the large thermal pad and the perimeter pads are to be mechanically or electrically connected to
the PC board. The PCB top layer under the EN5365QI should be clear of any metal except for the
large thermal pad. The “grayed-out” area in Figure 7 represents the area that should be clear of any
metal (traces, vias, or planes), on the top layer of the PCB.
Figure 8 demonstrates the recommended PCB footprint for the EN5365QI. Figure 9 shows the shape
and location of the exposed metal pads as well as the mechanical dimension of the large thermal pad
and the pins.
Ground copper my extend under this pad.
However, DO NOT CONNECT (NC)
Ground copper my extend under this pad.
However, DO NOT CONNECT (NC)
Figure 7. Lead-Frame exposed metal. Grey area highlights exposed metal that is not to be mechanically or
electrically connected to the PCB.
14
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