參數(shù)資料
型號： EFM32TG842F8
廠商： Energy Micro
文件頁數(shù)： 62/68頁
文件大小： 0K
描述： IC MCU 32BIT 8KB FLASH LQFP64
標準包裝： 1,000
系列： Tiny Gecko
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 32MHz
連通性： I²C，IrDA，智能卡，SPI，UART/USART
外圍設(shè)備： 欠壓檢測/復位，DMA，I²S，LCD，POR，PWM，WDT
輸入/輸出數(shù)： 53
程序存儲器容量： 8KB（8K x 8）
程序存儲器類型： 閃存
RAM 容量： 2K x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 1x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 64-TQFP
包裝： 帶卷 (TR)
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32TG842FXX - d0072_Rev1.10
65
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32TG842 Memory Map with largest RAM and Flash sizes ........................................................................ 8
3.1. EM2 current consumption. RTC prescaled to 1kHz, 32.768 kHz LFRCO. ......................................................... 12
3.2. EM3 current consumption. ..................................................................................................................... 12
3.3. EM4 current consumption. ..................................................................................................................... 12
3.4. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 16
3.5. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 17
3.6. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 18
3.7. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 19
3.8. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 20
3.9. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 21
3.10. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 23
3.15. Integral Non-Linearity (INL) ................................................................................................................... 30
3.16. Differential Non-Linearity (DNL) .............................................................................................................. 31
3.17. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 32
3.18. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 33
3.19. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 34
3.20. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 35
3.22. OPAMP Common Mode Rejection Ratio ................................................................................................. 39
3.23. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 39
3.24. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 39
3.25. OPAMP Voltage Noise Spectral Density (Unity Gain) Vout=1V ..................................................................... 40
3.26. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 40
3.27. Typical ACMP Characteristics ............................................................................................................... 42
4.1. EFM32TG842 Pinout (top view, not to scale) .............................................................................................. 46
4.2. Opamp Pinout ...................................................................................................................................... 53
4.3. TQFP64 .............................................................................................................................................. 54
5.1. TQFP64 PCB Land Pattern ..................................................................................................................... 56
5.2. TQFP64 PCB Solder Mask ..................................................................................................................... 57
5.3. TQFP64 PCB Stencil Design ................................................................................................................... 58
6.1. Example Chip Marking ........................................................................................................................... 59
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