參數(shù)資料
型號(hào)： EFM32LG332F64
廠商： Energy Micro
文件頁(yè)數(shù)： 60/66頁(yè)
文件大?。?/td> 0K
描述： IC MCU 32BIT 64KB FLASH QFP64
標(biāo)準(zhǔn)包裝： 1,000
系列： Leopard Gecko
核心處理器： ARM? Cortex?-M4
芯體尺寸： 32-位
速度： 48MHz
連通性： I²C，IrDA，智能卡，SPI，UART/USART，USB
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，DMA，POR，PWM，WDT
輸入/輸出數(shù)： 50
程序存儲(chǔ)器容量： 64KB（64K x 8）
程序存儲(chǔ)器類(lèi)型： 閃存
RAM 容量： 32K x 8
電壓 - 電源 (Vcc/Vdd)： 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 2x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 64-TQFP
包裝： 帶卷 (TR)
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32LG332FXX - d0111_Rev1.10
63
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32LG332 Memory Map with largest RAM and Flash sizes ........................................................................ 9
3.1. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 16
3.2. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 17
3.3. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 18
3.4. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 19
3.5. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 20
3.6. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 21
3.7. Calibrated LFRCO Frequency vs Temperature and Supply Voltage ................................................................ 23
3.12. Integral Non-Linearity (INL) ................................................................................................................... 30
3.13. Differential Non-Linearity (DNL) .............................................................................................................. 31
3.14. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 32
3.15. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 33
3.16. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 34
3.17. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 35
3.19. ADC Temperature sensor readout ......................................................................................................... 36
3.20. OPAMP Common Mode Rejection Ratio ................................................................................................. 39
3.21. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 39
3.22. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 40
3.23. OPAMP Voltage Noise Spectral Density (Unity Gain) Vout=1V ..................................................................... 40
3.24. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 40
3.25. Typical ACMP Characteristics ............................................................................................................... 42
4.1. EFM32LG332 Pinout (top view, not to scale) .............................................................................................. 45
4.2. Opamp Pinout ...................................................................................................................................... 53
4.3. TQFP64 .............................................................................................................................................. 53
5.1. TQFP64 PCB Land Pattern ..................................................................................................................... 55
5.2. TQFP64 PCB Solder Mask ..................................................................................................................... 56
5.3. TQFP64 PCB Stencil Design ................................................................................................................... 57
6.1. Example Chip Marking ........................................................................................................................... 58
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