參數(shù)資料
型號(hào): EFM32LG230F64
廠商: Energy Micro
文件頁數(shù): 60/65頁
文件大小: 0K
描述: IC MCU 32BIT 64KB FLASH QFN64
標(biāo)準(zhǔn)包裝: 1,000
系列: Leopard Gecko
核心處理器: ARM? Cortex?-M4
芯體尺寸: 32-位
速度: 48MHz
連通性: I²C,IrDA,智能卡,SPI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 56
程序存儲(chǔ)器容量: 64KB(64K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 32K x 8
電壓 - 電源 (Vcc/Vdd): 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b,D/A 2x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 64-VFQFN 裸露焊盤
包裝: 帶卷 (TR)
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32LG230FXX - d0105_Rev1.10
63
www.energymicro.com
List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 7
3.1. Absolute Maximum Ratings ...................................................................................................................... 9
3.2. General Operating Conditions ................................................................................................................... 9
3.3. Environmental ....................................................................................................................................... 10
3.4. Current Consumption ............................................................................................................................. 11
3.5. Energy Modes Transitions ...................................................................................................................... 12
3.6. Power Management ............................................................................................................................... 12
3.7. Flash .................................................................................................................................................. 13
3.8. GPIO .................................................................................................................................................. 14
3.9. LFXO .................................................................................................................................................. 21
3.10. HFXO ................................................................................................................................................ 21
3.11. LFRCO .............................................................................................................................................. 22
3.12. HFRCO ............................................................................................................................................. 23
3.13. ULFRCO ............................................................................................................................................ 25
3.14. ADC .................................................................................................................................................. 25
3.15. DAC .................................................................................................................................................. 35
3.16. OPAMP ............................................................................................................................................. 36
3.17. ACMP ............................................................................................................................................... 40
3.18. VCMP ............................................................................................................................................... 42
3.19. Digital Peripherals ............................................................................................................................... 42
4.1. Device Pinout ....................................................................................................................................... 44
4.2. Alternate functionality overview ................................................................................................................ 47
4.3. GPIO Pinout ........................................................................................................................................ 51
4.4. QFN64 (Dimensions in mm) .................................................................................................................... 53
5.1. QFN64 PCB Land Pattern Dimensions (Dimensions in mm) .......................................................................... 54
5.2. QFN64 PCB Solder Mask Dimensions (Dimensions in mm) ........................................................................... 55
5.3. QFN64 PCB Stencil Design Dimensions (Dimensions in mm) ........................................................................ 56
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