- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄93320 > ECP100G 1 Watt, High Gain HBT Amplifier PDF資料下載
參數(shù)資料
| 型號： | ECP100G |
| 英文描述： | 1 Watt, High Gain HBT Amplifier |
| 中文描述： | 1瓦特，高增益異質(zhì)結(jié)雙極晶體管放大器 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 795K |
| 代理商： | ECP100G |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 7 of 9 June 2005
AH215 / ECP100G
1 Watt, High Gain HBT Amplifier
Product Information
AH215-S8 (SOIC-8 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
° C
Thermal Resistance (1), Rth
33
° C / W
Junction Temperature (2), Tjc
159
° C
Notes:
1. The thermal resistance is referenced from the junction-to-
case at a case temperature of 85
° C. Tjc is a function of
the voltage at pins 6 and 7 and the current applied to pins
6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
450 mA at an 85
° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247
° C.
Product Marking
The component will be marked with an
“AH215-S8” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Passes
/500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235
° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is strictly required for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8 All dimensions are in millimeters (inches). Angles are in degrees.
MTTF vs. GND Tab Temperature
100
1000
10000
100000
1000000
50
60
70
80
90
100
Tab temperature (° C)
M
TTF
(
m
illio
n
h
rs
)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ECS-1000A-10 | Crystal Oscillator |
| ECS-1000A-1000 | Crystal Oscillator |
| ECS-1000B-10 | Crystal Oscillator |
| ECS-1000B-1000 | Crystal Oscillator |
| ECS-1000C-10 | Crystal Oscillator |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ECP101 | 功能描述:折皺器 Xcelite Crimp Tool 22-10AWG Non-insultd RoHS:否 制造商:Hirose Connector 類型: 描述/功能:Cable and Shield Crimper |
| ECP10-10K | 制造商: 功能描述:ECP10-10K |
| ECP102 | 功能描述:折皺器 CRIMP TL RG58/59/62 RoHS:否 制造商:Hirose Connector 類型: 描述/功能:Cable and Shield Crimper |
| ECP103 | 制造商:WJCI 制造商全稱:WJCI 功能描述:1 Watt, High Linearity InGaP HBT Amplifier |
| ECP103D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1 Watt, High Linearity InGaP HBT Amplifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。