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參數(shù)資料
| 型號： | ECP050D-PCB2140 |
| 英文描述： | 1/2 Watt, High Linearity InGaP HBT Amplifier |
| 中文描述： | 1 / 2瓦特，高線性InGaP HBT功率放大器 |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 483K |
| 代理商： | ECP050D-PCB2140 |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 5
April 2006
ECP050D
Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge TM
ECP050D-G Mechanical Information
This package is lead-free/RoHS-compliant. It is compatible with both lead-free (maximum 260
qC reflow temperature) and leaded
(maximum 245
qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
qC
Thermal Resistance, Rth (1)
62
qC / W
Junction Temperature, Tj (2)
162
qC
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 § C. Tjc is a function of the voltage at pins 10 and 11 and
the current applied to pins 10, 11, and 16 and can be calculated by:
Tj = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85
§
C case temperature. A minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 § C.
Product Marking
The component will be marked with an
“E050G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E050”
designator
followed
by
an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Passes between 500 and 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 1 at +260 ¨ C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1.
A heatsink underneath the area of the PCB for the mounted
device is recommended for proper thermal operation.
2.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25
mm (.010” ).
3.
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6.
RF trace width depends upon the PC board material and
construction.
7.
Use 1 oz. Copper minimum.
8.
All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Tab Temperature
100
1000
10000
100000
1000000
50
60
70
80
90
100
Tab Temperature (°C )
M
T
F
(m
il
li
o
n
h
rs
)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ECP050G | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1/2 Watt, High Linearity InGaP HBT Amplifier |
| ECP052 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| ECP052D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| ECP052D_06 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| ECP052D-G | 功能描述:射頻放大器 800-1000MHz 18dB Gain@900MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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