參數(shù)資料
型號(hào): EBE51RD8AGFA-6E-E
廠商: ELPIDA MEMORY INC
元件分類: DRAM
英文描述: 512MB Registered DDR2 SDRAM DIMM (64M words x 72 bits, 1 Rank)
中文描述: 64M X 72 DDR DRAM MODULE, 0.45 ns, DMA240
封裝: ROHS COMPLIANT, DIMM-240
文件頁數(shù): 12/22頁
文件大?。?/td> 190K
代理商: EBE51RD8AGFA-6E-E
EBE51RD8AEFA
Data Sheet E0645E30 (Ver. 3.0)
12
Parameter
Symbol Grade
max.
Unit
Test condition
tCK = tCK (IDD);
Refresh command at every tRFC (IDD) interval;
CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
Self Refresh Mode;
CK and /CK at 0V;
CKE
0.2V;
Other control and address bus inputs are FLOATING;
Data bus inputs are FLOATING
all bank interleaving reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = tRCD (IDD)
1
×
tCK (IDD);
tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD),
tRCD = 1
×
tCK (IDD);
CKE is H, CS is H between valid commands;
Address bus inputs are STABLE during DESELECTs;
Data pattern is same as IDD4W;
Auto-refresh current
IDD5
-5C
-4A
2730
2510
mA
Self-refresh current
IDD6
80
mA
Operating current
(Bank interleaving)
IDD7
-5C
-4A
3610
3330
mA
Notes: 1. IDD specifications are tested after the device is properly initialized.
2. Input slew rate is specified by AC Input Test Condition.
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, /DQS, RDQS, /RDQS, LDQS, /LDQS, UDQS, and /UDQS. IDD
values must be met with all combinations of EMRS bits 10 and 11.
5. Definitions for IDD
L is defined as VIN
VIL (AC) (max.)
H is defined as VIN
VIH (AC) (min.)
STABLE is defined as inputs stable at an H or L level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between H and L every other clock cycle (once per two clocks) for address and control
signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals
not including masks or strobes.
6. Refer to AC Timing for IDD Test Conditions.
AC Timing for IDD Test Conditions
For purposes of IDD testing, the following parameters are to be utilized.
DDR2-533
DDR2-400
Parameter
4-4-4
3-3-3
Unit
CL(IDD)
4
3
tCK
tRCD(IDD)
15
15
ns
tRC(IDD)
60
55
ns
tRRD(IDD)
7.5
7.5
ns
tCK(IDD)
3.75
5
ns
tRAS(min.)(IDD)
45
40
ns
tRAS(max.)(IDD)
70000
70000
ns
tRP(IDD)
15
15
ns
tRFC(IDD)
105
105
ns
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