參數(shù)資料
型號(hào)： DSP56F826E
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： 16-bit Digital Signal Controllers
中文描述： 16位數(shù)字信號(hào)控制器
文件頁(yè)數(shù)： 20/56頁(yè)
文件大小： 700K
代理商： DSP56F826E
56F826 Technical Data, Rev. 14
20
Freescale Semiconductor
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (
R
θ
JA
) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p, where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
θ
JC
), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
Thermal Characterization Parameter, Psi-JT (
Ψ
JT
), is the “resistance” from junction to reference point
thermocouple on top center of case as defined in JESD51-2.
Ψ
JT
is a useful value to use to estimate junction
temperature in steady state customer environments.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
See Section 5.1 for more details on thermal design considerations.
TJ = Junction Temperature
TA = Ambient Temperature
2.
3.
4.
5.
6.
7.
Table 3-3 Thermal Characteristics
6
Characteristic
Comments
Symbol
Value
Unit
Notes
100-pin LQFP
Junction to ambient
Natural convection
R
θ
JA
48.3
°C/W
2
Junction to ambient (@1m/sec)
R
θ
JMA
43.9
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
R
θ
JMA
(2s2p)
40.7
°C/W
1.2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
R
θ
JMA
38.6
°C/W
1,2
Junction to case
R
θ
JC
13.5
°C/W
3
Junction to center of case
Ψ
JT
1.0
°C/W
4, 5
I/O pin power dissipation
P
I/O
User Determined
W
Power dissipation
P
D
P
D
= (I
DD
x V
DD
+ P
I/O
)
W
Junction to center of case
P
DMAX
(TJ - TA) /R
θ
JA
W
7
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