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DSP201/202
4
INTERMODULATION DISTORTION vs TEMPERATURE
Ambient Temperature (°C)
I
–85
–90
–95
–100
–105
–50
–25
0
25
50
75
100
f + f = 0dB
f = 9.5kHz
f = 11.5kHz
POWER SUPPLY REJECTION vs
SUPPLY RIPPLE FREQUENCY
Supply Ripple Frequency (kHz)
0.1
1
10
100
–35
–45
–55
–65
–75
S
V + = V +
V – = V –
OUTPUT VOLTAGE SETTLING TIME
Settling Time (μs)
0
1
2
3
4
5
6
7
8
9
10
0.1
0.01
0.001
A
R = 1.5k
C = 100pF
+Full Scale to
–Full Scale Transition
–Full Scale to
+Full Scale Transition
TYPICAL PERFORMANCE CURVES
(CONT)
T
= +25
°
C; Update Frequency, f
= 400kHz; V
+ = V
+ = +5V; V
A
– = V
D
– = 5V; SWL = HIGH; CASC = LOW;
Output Bandwidth Limited to 20kHz; unless otherwise noted.
The DSP201 and DSP202 are ESD (electrostatic discharge)
sensitive devices, and normal standard precautions should be
taken. Permanent damage may occur on unconnected devices
subject to high energy electrostatic fields. When not in use,
devices must be stored in conductive foam or shunts. The
protective foam should be discharged to the destination socket
before devices are removed.
PACKAGE INFORMATION
PACKAGE DRAWING
NUMBER
(1)
MODEL
PACKAGE
DSP201JP
DSP201KP
DSP202JP
DSP202KP
28-Pin Plastic DIP
28-Pin Plastic DIP
28-Pin Plastic DIP
28-Pin Plastic DIP
215
215
215
215
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
ORDERING INFORMATION
NUMBER
OF
CHANNELS
SIGNAL-TO-
(NOISE + DIST.)
RATIO, dB min
MODEL
1-24
25-99
100+
DSP201JP
DSP201KP
DSP202JP
DSP202KP
1
1
2
2
82
88
82
88
ABSOLUTE MAXIMUM RATINGS
V
A
+ to Analog Common ......................................................................+7V
V
A
– to Analog Common...................................................................... –7V
V
D
+ to Digital Common ..................................................................... +7V
V
– to Digital Common....................................................................... –7V
Analog Common to Digital Common ...................................................
±
1V
Control Inputs to Digital Common ............................... –0.5 to V
+ 0.5V
Maximum Junction Temperature ..................................................... 150
o
C
Internal Power Dissipation ............................................................. 825mW
Lead Temperature (soldering, 10s) ............................................... +300
o
C
Thermal Resistance,
θ
JA
: Plastic DIP ............................................50
o
C/W
ELECTROSTATIC
DISCHARGE SENSITIVITY