參數(shù)資料
型號(hào): DS21352G
廠商: Maxim Integrated Products
文件頁數(shù): 104/137頁
文件大?。?/td> 0K
描述: IC TXRX T1 1-CHIP 3.3V 100-BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 240
功能: 單芯片收發(fā)器
接口: HDLC,T1
電路數(shù): 1
電源電壓: 3.14 V ~ 3.47 V
電流 - 電源: 75mA
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 100-LFBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 100-CSBGA(10x10)
包裝: 托盤
包括: DSX-1 和 CSU 線路補(bǔ)償發(fā)生器,HDLC 控制器,帶內(nèi)回路代碼發(fā)生器和檢測(cè)器
DS21352/DS21552
69 of 137
Like the SR1 and SR2 status registers, the HSR register has the unique ability to initiate a hardware
interrupt via the INT* output pin. Each of the events in the HSR can be either masked or unmasked from
the interrupt pin via the HDLC Interrupt Mask Register (HIMR). Interrupts will force the INT* pin low
when the event occurs. The INT pin will be allowed to return high (if no other interrupts are present)
when the user reads the event bit that caused the interrupt to occur.
15.3.3 BASIC OPERATION DETAILS
To allow the framer to properly source/receive data from/to the HDLC and BOC controller the legacy FDL circuitry (which is
described in Section 15.4) should be disabled and the following bits should be programmed as shown:
TCR1.2 = 1 (source FDL data from the HDLC and BOC controller)
TBOC.6 = 1 (enable HDLC and BOC controller)
CCR2.5 = 0 (disable SLC–96 and D4 Fs–bit insertion)
CCR2.4 = 0 (disable legacy FDL zero stuffer)
CCR2.1 = 0 (disable SLC–96 reception)
CCR2.0 = 0 (disable legacy FDL zero stuffer)
IMR2.4 = 0 (disable legacy receive FDL buffer full interrupt)
IMR2.3 = 0 (disable legacy transmit FDL buffer empty interrupt)
IMR2.2 = 0 (disable legacy FDL match interrupt)
IMR2.1 = 0 (disable legacy FDL abort interrupt).
As a basic guideline for interpreting and sending both HDLC messages and BOC messages, the following sequences can be
applied:
15.3.3.1 RECEIVE AN HDLC MESSAGE OR A BOC
1) Enable RBOC and RPS interrupts.
2) Wait for interrupt to occur.
3) If RBOC=1, then follow steps 5 and 6.
4) If RPS=1, then follow steps 7 through 13.
5) If LBD=1, a BOC is present, then read the code from the RBOC register and take action as needed.
6) If BD=0, a BOC has ceased, take action as needed and then return to step 1.
7) Disable RPS interrupt and enable either RPE, RNE, or RHALF interrupt.
8) Read RHIR to obtain REMPTY status.
a) If REMPTY=0, then record OBYTE, CBYTE, and POK bits and then read the FIFO.
i)
If CBYTE=0 then skip to step 9.
ii) If CBYTE=1 then skip to step 11.
b) If REMPTY=1, then skip to step 10.
9) Repeat step 8.
10) Wait for interrupt, skip to step 8.
11) If POK=0, then discard whole packet.
12) If POK=1, accept the packet.
13) Disable RPE, RNE, or RHALF interrupt, enable RPS interrupt and return to step 1.
相關(guān)PDF資料
PDF描述
DS2174QN+T&R IC BERT ENHANCED 44-PLCC
DS2155GNC2+T&R TXRX T1/E1/J1 SGL 100CSBGA
DS2155GNC2+ IC TXRX T1/E1/J1 100-CSBGA
DS2155GN IC TXRX T1/E1/J1 1-CHIP 100CSBGA
DS2174Q+ IC BERT ENHANCED 44-PLCC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21352GN 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352L 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352L+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LB 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21352LB+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray