
DS1486P
070298 12/16
AC ELECTRICAL CHARACTERISTICS POWER–UP POWER–DOWN TIMING
(0
°
C to 70
°
C)
PARAMETER
SYMBOL
MIN
MAX
UNITS
NOTES
CE High to Power Fail
t
PF
0
ns
Recovery at Power Up
t
REC
200
ms
V
CC
Slew Rate
Power Down
t
F
4.0<V
CC
<4.5V
300
μ
s
V
Slew Rate
Power Down
t
FB
3.0<V
CC
<4.25V
10
μ
s
V
CC
Slew Rate
Power Up
t
R
4.5V>V
CC
>4.0V
0
μ
s
Expected Data Retention
t
DR
10
years
9
WARNING:
Under no circumstances are negative undershoots, of any amplitude, allowed when device is in battery backup mode.
NOTES:
1. WE is high for a read cycle.
2. OE = V
IH
or V
IL
. If OE = V
IH
during write cycle, the output buffers remain in a high impedance state.
3. t
WP
is specified as the logical AND of the CE and WE. t
WP
is measured from the latter of CE or WE going low
to the earlier of CE or WE going high.
4. t
DS
or t
DH
are measured from the earlier of CE or WE going high.
5. t
DH
is measured from WE going high. If CE is used to terminate the write cycle, then t
DH
= 20 ns for –120 parts
and t
DH
= –25 ns for –150 parts.
6. If the CE low transition occurs simultaneously with or later than the WE low transition in Write Cycle 1, the output
buffers remain in a high impedance state during this period.
7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output buffers remain
in a high impedance state during this period.
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition, the output buffers
remain in a high impedance state during this period.
9. Each DS1486 is marked with a four digit date code AABB. AA designates the year of manufacture. BB designates
the week of manufacture. The expected t
DR
is defined for DIP Modules as starting at the date of manufacture.
10.All voltages are referenced to ground.
11. Applies to both interrupt pins when the alarms are set to pulse.
12.Interrupt output occurs within 100 ns on the alarm condition existing.
13.Both INTA and INTB(INTB) are open drain outputs.
14.Real–Time Clock Modules (DIP) can be successfully processed through conventional wave–soldering tech-
niques as long as temperature exposure to the lithium energy source contained within does not exceed +85
°
C.
Post solder cleaning with water washing techniques is acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“l(fā)ive – bug”).
b. Hand Soldering and touch – up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part,
apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.