參數(shù)資料
型號(hào)： DRV401AIRGWRG4
廠商： TEXAS INSTRUMENTS INC
元件分類： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PQCC20
封裝： 5 X 5 MM, GREEN, PLASTIC, QFN-20
文件頁(yè)數(shù)： 31/36頁(yè)
文件大?。?/td> 963K
代理商： DRV401AIRGWRG4
DRV401
SBVS070B JUNE 2006 REVISED MAY 2009
www.ti.com
4
ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the specified temperature range, TJ = 40°C to +125°C, with zero output current ICOMP.
At TA = +25°C and VDD1 = VDD2 = +5V with external 100kHz filter BW, unless otherwise noted.
DRV401
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VOLTAGE REFERENCE
Voltage(2)
No Load
2.495
2.5
2.505
V
Drift(2)
No Load
±5
±50
ppm/
°C
PSRR(2)
±15
±200
V/V
Load Regulation(2)
Load to GND/VDD, dI = 0mA to 5mA
0.15
mV/mA
Short-Circuit Current
ISC
REFOUT Connected to VDD
+20
mA
REFOUT Connected to GND
18
mA
DEMAGNETIZATION
Duration
See Timing Diagram
106
130(3)
ms
DIGITAL I/O
LOGIC INPUTS (DEMAG, GAIN, and CCdiag Pins)
CMOS Type Levels
Pull-Up High Current (CCdiag)
3.5 < VIN < VDD
160
A
Pull-Up Low Current (CCdiag)
0 < VIN < 1.5
5
A
Logic Input Leakage Current
0 < VIN < VDD
0.01
5
A
Logic Level, Input: L/H
2.1/2.8
V
Hysteresis
0.7
V
OUTPUTS (ERROR AND OVER-RANGE Pins)
Logic Level, Output: L
4mA Sink
0.3
V
Logic Level, Output: H
No Internal Pull-Up
OUTPUTS (PWM and PWM Pins)
Push-Pull Type
Logic Level L
4mA Sink
0.2
V
Logic Level H
4mA Source
(VDD) 0.4
V
POWER SUPPLY
Specified Voltage Range
VDD
4.5
5
5.5
V
Power-On Reset Threshold
VRST
1.8
V
Quiescent Current [I(VDD1) + I(VDD2)]
IQ
ICOMP = 0mA, Sensor Not Connected
6.8
mA
Brownout Voltage Level(2)
4
V
Brownout Indication Delay
135
s
TEMPERATURE RANGE
Specified Range
TJ
40
+125
°C
Operating Range
TJ
50
+150
°C
Package Thermal Resistance
QFN Surface-Mount
qJA
See Note 6
40
°C/W
SO PowerPAD Surface-Mount
qJA
See Note 6
27
°C/W
(1) Parameter value referred to output (RTO).
(2) See Typical Characteristic curves.
(3) Total input resistance and comparator threshold current are inversely related. See Figure 2a.
(4) For VAC sensors, 0.2% of PWM offset approximately corresponds to 10mA primary current offset per winding.
(5) See Compensation Driver section in Applications Information.
(6) See Applications Information section for information on power dissipation, layout considerations, and proper PCB soldering and heat-sinking technique.
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