參數(shù)資料
型號: DC1786A
廠商: Linear Technology
文件頁數(shù): 26/36頁
文件大小: 0K
描述: BOARD DEMO LTC2871
設(shè)計資源: DC1786A Design Files
DC1786A Schematic
標(biāo)準(zhǔn)包裝: 1
主要目的: 接口,收發(fā)器,RS-232/RS-485
嵌入式:
已用 IC / 零件: LTC2871
主要屬性: 3 個驅(qū)動器,3 個接收器
次要屬性: 3 V ~ 5.5 V 電源
已供物品:
相關(guān)產(chǎn)品: LTC2871CUHF#PBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871IUHF#PBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871CFE#PBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871IFE#PBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871CUHF#TRPBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871IFE#TRPBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871IUHF#TRPBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871CFE#TRPBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2870/LTC2871
32
28701f
PACKAGE DESCRIPTION
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
FE28 (EB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
13
4
5
6 7 89 10 11 12 13 14
19
20
22 21
15
16
18 17
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
2.74
(.108)
28 2726 25 24 23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
4.75
(.187)
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
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