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參數(shù)資料
| 型號： | DAC8426FS |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 6/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 8BIT QUAD W/V-REF 20-SOIC |
| 產(chǎn)品培訓模塊： | Data Converter Fundamentals DAC Architectures |
| 標準包裝： | 1 |
| 設置時間： | 3µs |
| 位數(shù)： | 8 |
| 轉(zhuǎn)換器數(shù)目： | 4 |
| 電壓電源： | 雙 ± |
| 功率耗散（最大）： | 210mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-SOIC（0.295"，7.50mm 寬） |
| 供應商設備封裝： | 20-SOIC W |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 4 電流，單極；4 電流，雙極 |
| 采樣率（每秒）： | 333k |
DAC8426
–3–
REV. C
CAUTION
1. Do not apply voltages higher than VDD or less than VSS po-
tential on any terminal.
2. The digital control inputs are zener-protected; however,
permanent damage may occur on unprotected units from
high-energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets. Remove
power before insertion or removal.
4. Stresses above those listed under “Absolute Maximum Rat-
ings” may cause permanent damage to device.
Burn-In Circuit
ABSOLUTE MAXIMUM RATINGS
VDD to AGND or DGND . . . . . . . . . . . . . . . . . –0.3 V, +17 V
VSS to AGND or DGND . . . . . . . . . . . . . . . . . . . . . –7 V, VDD
VDD to VSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +24 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +5 V
Digital Input Voltage to DGND . . . . . . . . . . . . . –0.3 V, VDD
VREFOUT to AGND
1
. . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
VOUT to AGND
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
Operating Temperature
Military AR/BR . . . . . . . . . . . . . . . . . . . . –55
°C to +125°C
Extended Industrial ER/EP/FR/FP/FS . . . . –40
°C to +85°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
THERMAL RESISTANCE
Package Type
JA
2
JC
Units
20-Pin Cerdip (R)
70
7
°C/W
20-Pin Plastic DIP (P)
61
24
°C/W
20-Pin SOL(S)
80
22
°C/W
NOTES
1Outputs may be shorted to any terminal provided the package power dissipation
is not exceeded. Typical output short-circuit current to AGND is 50 mA.
2
θ
JA is specified for worst case mounting conditions, i.e., θJA is specified for de-
vice in socket for cerdip and P-DIP packages;
θ
JA is specified for device sol-
dered to printed circuit board for SOL package.
20-Pin Cerdip
(R Suffix)
20-Pin Epoxy DIP
(P Suffix)
20-Pin SOL
(S Suffix)
PIN CONNECTIONS
ORDERING GUIDE
1
Model
Total Unadjusted Error
Temperature Range
Package Description
DAC8426AR
2
±1 LSB
–55
°C to +125°C
20-Pin Cerdip (Q-20)
DAC8426ER
±1 LSB
–40
°C to +85°C
20-Pin Cerdip (Q-20)
DAC8426EP
±1 LSB
–40
°C to +85°C
20-Pin Plastic DIP (N-20)
DAC8426BR
2
±2 LSB
–55
°C to +125°C
20-Pin Cerdip (Q-20)
DAC8426FR
±2 LSB
–40
°C to +85°C
20-Pin Cerdip (Q-20)
DAC8426FP
±2 LSB
–40
°C to +85°C
20-Pin Plastic DIP (N-20)
DAC8426FS
3
±2 LSB
–40
°C to +85°C
20-Lead SOL (R-20)
NOTES
1Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.
2For devices processed in total compliance to MIL-STD-883, add /883 after part number. Consult factory for 883 data sheet.
3For availability and burn-in information on SO and PLCC packages, contact your local sales office.
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