
3
DAC707/708/709
PACKAGE DRAWING
NUMBER
(1)
PRODUCT
PACKAGE
DAC707JP
DAC707KP
28-Pin Plastic DBL Wide DIP
28-Pin Plastic DBL Wide DIP
215
215
DAC707BH
28LD Side Brazed
Hermetic Dip
28LD Side Brazed
Hermetic DIP
28LD Side Brazed
Hermetic DIP
149
DAC707KH
149
DAC707SH
149
DAC708BH
24LD Side Brazed
Hermetic DIP
24LD Side Brazed
Hermetic DIP
24LD Side Brazed
Hermetic DIP
165
DAC708KH
165
DAC708SH
165
DAC709BH
24LD Side Brazed
Hermetic DIP
24LD Side Brazed
Hermetic DIP
24LD Side Brazed
Hermetic DIP
165
DAC709KH
165
DAC709SH
165
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
DAC707/708/709KH,
DAC707KP
DAC707/708/
709BH, SH
DAC707JP
PRODUCT
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
At T
A
= +25
°
C, V
CC
=
±
15V, V
DD
= +5V, and after a 10-minute warm-up, unless otherwise noted.
ELECTRICAL (CONT)
*Specification same as for models in column to the left.
NOTES: (1) MSB must be inverted externally prior to DAC708/709 input. (2) Digital inputs are TTL, LSTTL, 54/74C, 54/74HC and 54/74HTC compatible over the specified
temperature range. (3) DAC708 (current-output models) are specified and tested with an external output operational amplifier connected using the internal feedback
resistor in all tests. (4) FSR means Full Scale Range. For example, for
±
10V output, FSR = 20V. (5)
±
0.0015% of Full Scale Range is equal to 1 LSB in 16-bit resolution,
±
0.003% of Full Scale Range is equal to 1 LSB in 15-bit resolution.
±
0.006% of Full Scale Range is equal to 1 LSB in 14-bit resolution. (6) Error at input code 0000
H
.
(For unipolar connection on DAC708/709, the MSB must be inverted externally prior to D/A input.) (7) Adjustable to zero with external trim potentiometer. Adjusting the
gain potentiometer rotates the transfer function around the bipolar zero point. (8) With gain and zero errors adjusted to zero at +25
°
C. (9) Maximum represents the 3
σ
limit. Not 100% tested for this parameter. (10) The bipolar worst-case code change is FFFF
H
to 0000
H
and 0000
H
to FFFF
H
. For unipolar (DAC708/709 only) it is 7FFF
H
to 8000
H
and 8000
H
to 7FFF
H
.
POWER SUPPLY REQUIREMENTS
Voltage (all models): +V
CC
+13.5
–13.5
+4.5
+15
–15
+5
+16.5
–16.5
+5.5
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
V
V
V
–V
CC
V
Current (No Load, +15V Supplies)
Current Output Models: +V
CC
+10
–13
+5
*
*
*
+25
–25
+10
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
mA
mA
mA
mA
mA
mA
–V
CC
V
DD
Voltage Output Models: +V
CC
+16
–18
+5
+30
–30
+10
–V
CC
V
DD
Power Dissipation (
±
15V supplies)
Current Output Models
Voltage Output Models
370
*
800
950
*
*
*
*
mW
mW
535
TEMPERATURE RANGE
Specification: BH Grades
–25
+85
°
C
°
C
°
C
°
C
°
C
JP, KP, KH Grades
SH Grades
0
+70
*
*
–55
–65
+125
+150
Storage: Ceramic
–65
*
+150
*
Plastic
–60
+100
PACKAGE INFORMATION
ABSOLUTE MAXIMUM RATINGS
V
DD
to COMMON........................................................................ 0V, +15V
+V
CC
to COMMON ..................................................................... 0V, +18V
–V
to COMMON...................................................................... 0V, –18V
Digital Data Inputs to COMMON..................................... –0.5V, V
DD
+0.5
DC Current any input .....................................................................
±
10mA
Reference Out to COMMON ...................... Indefinite Short to COMMON
V
(DAC707, DAC709) ........................... Indefinite Short to COMMON
External Voltage Applied to R
(pin 13 or 14, DAC708) ..................
±
18V
External Voltage Applied to D/A Output
(pin 1, DAC707; pin 14, DAC709) .........................................................
±
5V
Power Dissipation ........................................................................1000mW
Storage Temperature..................................................... –60
°
C to +150
°
C
Lead Temperature (soldering, 10s)................................................. 300
°
C
Stresses above those listed under “Absolute Maximum Ratings” may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.