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3
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ABSOLUTE MAXIMUM RATINGS
(1)
AV
DD
to DV
...................................................................................
±
0.3V
AV
DD
to AGND ........................................................................ –0.3V to 6V
DV
to DGND ....................................................................... –0.3V to 6V
AGND to DGND ...............................................................................
±
0.3V
V
Voltage to AGND .......................................................... 2.0V to 3.0V
Digital Input Voltage to DGND .............................. –0.3V to DV
DD
+ 0.3V
Digital Output Voltage to DGND ........................... –0.3V to DV
DD
+ 0.3V
Package Power Dissipation............................................. (T
– T
)/
θ
JA
Maximum Junction Temperature (T
JMAX
) ..................................... +150
°
C
Thermal Resistance,
θ
SSOP-16................................................................................ 200
°
C/W
Lead Temperature (soldering, 10s)............................................... +300
°
C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PIN CONFIGURATION
Top View
SSOP
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
DV
DD
X
OUT
X
IN
DGND
AV
DD
DNC
DNC
DNC
C
1
C
2
V
OUT
V
REF
AGND
CS
SDIO
SCLK
Digital Supply, +5V nominal
System Clock Output (for Crystal)
System Clock Input
Digital Ground
Analog Supply, +5V nominal
Do Not Connect
Do Not Connect
Do Not Connect
Filter Capacitor, see text.
Filter Capacitor, see text.
Analog Output Voltage
Reference Input
Analog Ground
Chip Select Input
Serial Data Input/Output
Clock Input for Serial Data Transfer
PACKAGE/ORDERING INFORMATION
MAXIMUM
LINEARITY
ERROR
(LSB)
PACKAGE
DRAWING
NUMBER
SPECIFICATION
TEMPERATURE
RANGE
ORDERING
NUMBER
(1)
TRANSPORT
MEDIA
PRODUCT
PACKAGE
DAC1220E
±
1
"
SSOP-16
"
322
"
–40
°
C to +85
°
C
"
DAC1220E
DAC1220E/2K5
Rails
"
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC1220E/2K5” will get a single 2500-piece Tape and Reel.
1
2
3
4
5
6
7
8
DV
DD
X
OUT
X
IN
DGND
AV
DD
DNC
DNC
DNC
SCLK
SDIO
CS
AGND
V
REF
V
OUT
C
2
C
1
16
15
14
13
12
11
10
9
DAC1220E