參數(shù)資料
型號： CY7C1524AV18-250BZXI
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
中文描述： 2M X 36 DDR SRAM, 0.45 ns, PBGA165
封裝： 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁數(shù)： 11/28頁
文件大?。?/td> 1133K
代理商： CY7C1524AV18-250BZXI
PRELIMINARY
CY7C1522AV18
CY7C1529AV18
CY7C1523AV18
CY7C1524AV18
Document #: 001-06981 Rev. *B
Page 11 of 28
Write Cycle Descriptions
(CY7C1524AV18)
[3, 9]
BWS
0
L
BWS
1
L
BWS
2
L
BWS
3
L
K
K
–
Comments
L-H
During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are written into
the device.
L-H During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are written into
the device.
-
During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is written
into the device. D
[35:9]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is written
into the device. D
[35:9]
will remain unaltered.
–
During the Data portion of a Write sequence, only the byte (D
[17:9]
) is written into
the device. D
[8:0]
and D
[35:18]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[17:9]
) is written into
the device. D
[8:0]
and D
[35:18]
will remain unaltered.
–
During the Data portion of a Write sequence, only the byte (D
[26:18]
) is written into
the device. D
[17:0]
and D
[35:27]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[26:18]
) is written into
the device. D
[17:0]
and D
[35:27]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[35:27]
) is written into
the device. D
[26:0]
will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D
[35:27]
) is written into
the device. D
[26:0]
will remain unaltered.
–
No data is written into the device during this portion of a Write operation.
L-H No data is written into the device during this portion of a Write operation.
Write Cycle Descriptions
(CY7C1529AV18)
[3
,
9]
L
L
L
L
–
L
H
H
H
L-H
L
H
H
H
–
H
L
H
H
L-H
H
L
H
H
–
H
H
L
H
L-H
H
H
L
H
–
H
H
H
L
L-H
H
H
H
L
–
H
H
H
H
H
H
H
H
L-H
–
BWS
0
L
L
H
H
K
K
–
Comments
L-H
–
L-H
–
During the Data portion of a Write sequence, the single byte (D
[8:0]
) is written into the device.
During the Data portion of a Write sequence, the single byte (D
[8:0]
) is written into the device.
No data is written into the device during this portion of a Write operation.
No data is written into the device during this portion of a Write operation.
L-H
–
L-H
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相關(guān)PDF資料
PDF描述
CY7C1524AV18-278BZC 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1524AV18-278BZI 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1524AV18-278BZXC 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1524AV18-278BZXI 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1524AV18-300BZC 72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1525JV18250BZC 制造商:Cypress Semiconductor 功能描述:
CY7C1525JV18-250BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 8M x 9 1.8V QDR-II 靜態(tài)隨機(jī)存取存儲器 Two-Word Burst RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1525JV18-250BZCES 制造商:Rochester Electronics LLC 功能描述: 制造商:Cypress Semiconductor 功能描述:
CY7C1525JV18-250BZXC 功能描述:靜態(tài)隨機(jī)存取存儲器 8M x 9 1.8V QDR-II 靜態(tài)隨機(jī)存取存儲器 Two-Word Burst RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1525KV18-250BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 72MB (8Mx9) 1.8v 250MHz QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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