參數(shù)資料
型號: CY7C1418BV18-278BZXI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 36-Mbit DDR-II SRAM 2-Word Burst Architecture
中文描述: 2M X 18 DDR SRAM, 0.45 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁數(shù): 26/28頁
文件大?。?/td> 1132K
代理商: CY7C1418BV18-278BZXI
PRELIMINARY
CY7C1416BV18
CY7C1427BV18
CY7C1418BV18
CY7C1420BV18
Document Number: 001-07033 Rev. *B
Page 26 of 28
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CY7C1418BV18-200BZC
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CY7C1416BV18-200BZXC 51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free Commercial
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51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
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CY7C1416BV18-200BZXI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
CY7C1427BV18-200BZXI
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CY7C1416BV18-167BZC
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
CY7C1427BV18-167BZC
CY7C1418BV18-167BZC
CY7C1420BV18-167BZC
CY7C1416BV18-167BZXC 51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free Commercial
CY7C1427BV18-167BZXC
CY7C1418BV18-167BZXC
CY7C1420BV18-167BZXC
CY7C1416BV18-167BZI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
CY7C1427BV18-167BZI
CY7C1418BV18-167BZI
CY7C1420BV18-167BZI
CY7C1416BV18-167BZXI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
CY7C1427BV18-167BZXI
CY7C1418BV18-167BZXI
CY7C1420BV18-167BZXI
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
Industrial
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51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free
Industrial
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51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
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Industrial
Ordering Information
(continued)
“Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit
www.cypress.com
for actual products offered”.
Speed
(MHz)
Ordering Code
Diagram
Package
Package Type
Operating
Range
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相關(guān)PDF資料
PDF描述
CY7C1418BV18-300BZC 36-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1418BV18-300BZI 36-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1418BV18-300BZXC 36-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1418BV18-300BZXI 36-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1440AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM(36-Mb (1M x 36/2M x 18/512K x 72)管道式同步SRAM)
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CY7C1418JV18-300BZC 功能描述:靜態(tài)隨機存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1418JV18-300BZXC 功能描述:靜態(tài)隨機存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1418KV18-250BZC 功能描述:靜態(tài)隨機存取存儲器 36MB (2Mx18) 1.8v 250MHz DDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1418KV18-250BZCT 功能描述:靜態(tài)隨機存取存儲器 36864KB 1ms 430mA RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1418KV18-250BZI 功能描述:靜態(tài)隨機存取存儲器 36MB (2Mx18) 1.8v 250MHz DDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray