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參數(shù)資料
| 型號(hào)： | CY7C1386D-200BZXC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| 中文描述： | 512K X 36 CACHE SRAM, 3 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 |
| 文件頁數(shù)： | 29/30頁 |
| 文件大?。?/td> | 974K |
| 代理商： | CY7C1386D-200BZXC |
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CY7C1386D, CY7C1386F
CY7C1387D, CY7C1387F
Document Number: 38-05545 Rev. *E
Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 29 of 30
Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. PowerPC is a trademark of IBM
Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.
Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
Package Diagrams
(continued)
A
1
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (165X)
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
5
6
7
8
9
10
10.00
1
B
C
D
E
F
G
H
J
K
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M
N
11
11
10
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7
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2
1
P
R
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L
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F
E
D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
10.00
0
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
51-85180-*A
A
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (0.25 M C A B
0.25 M0.05 M C
0.05 M C
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
5
6
7
8
9
10
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
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7
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3
2
1
P
R
P
R
K
M
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L
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H
G
F
E
D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
0
1
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
51-85180-*A
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相關(guān)PDF資料 |
PDF描述 |
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| CY7C1386D-200BZXI | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| CY7C1386D-250AXC | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| CY7C1387D-200BZC | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| CY7C1387D-200BZI | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| CY7C1387D-200BZXC | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1386D-250AXC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1386S-167AXC | 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 CY7C1386S-167AXC RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1386S-167AXCKJ | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1387B-150AC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1387B-150BGC | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Cypress Semiconductor 功能描述: |
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