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參數(shù)資料
| 型號： | CY7C1372C-250BZC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| 中文描述： | 1M X 18 ZBT SRAM, 2.6 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 |
| 文件頁數(shù)： | 15/27頁 |
| 文件大小： | 704K |
| 代理商： | CY7C1372C-250BZC |
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CY7C1370C
CY7C1372C
Document #: 38-05233 Rev. *D
Page 15 of 27
Identification Register Definitions
Instruction Field
Revision Number (31:29)
Cypress Device ID (28:12)
Cypress JEDEC ID (11:1)
ID Register Presence (0)
CY7C1370C
010
01010001000100101
00000110100
1
CY7C1372C
010
01010001000010101 Reserved for future use.
00000110100
Allows unique identification of SRAM vendor.
1
Indicate the presence of an ID register.
Description
Reserved for version number.
Scan Register Sizes
Register Name
Instruction
Bypass
ID
Boundary Scan
Bit Size(x18)
3
1
32
70
Bit Size (x36)
3
1
32
70
Identification Codes
Instruction
EXTEST
Code
000
Description
Captures the Input/Output ring contents. Places the boundary scan register between the TDI and
TDO. Forces all SRAM outputs to High-Z state. This instruction is not 1149.1-compliant.
Loads the ID register with the vendor ID code and places the register between TDI and TDO. This
operation does not affect SRAM operation.
Captures the Input/Output contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
Do Not Use: This instruction is reserved for future use.
Captures the Input/Output ring contents. Places the boundary scan register between TDI and TDO.
Does not affect the SRAM operation. This instruction does not implement 1149.1 preload function
and is therefore not 1149.1-compliant.
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect SRAM operation.
IDCODE
001
SAMPLE Z
010
RESERVED
SAMPLE/PRELOAD
011
100
RESERVED
RESERVED
BYPASS
101
110
111
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1372CV25-167BZC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1372D-167AXC | 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1372D-167AXCT | 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1372D-167AXI | 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 IND RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1372D-167AXIKJ | 制造商:Cypress Semiconductor 功能描述: |
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