參數(shù)資料
型號： CY7C1370C-250BZI
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
中文描述： 512K X 36 ZBT SRAM, 2.6 ns, PBGA165
封裝： 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
文件頁數(shù)： 17/27頁
文件大?。?/td> 704K
代理商： CY7C1370C-250BZI
CY7C1370C
CY7C1372C
Document #: 38-05233 Rev. *D
Page 17 of 27
165-Ball fBGA Boundary Scan Order
CY7C1370C (512K x 36)
Ball ID
B6
B7
A7
B8
A8
B9
A9
B10
A10
C11
E10
F10
G10
D10
D11
E11
F11
Bit#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Bit#
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Ball ID
R6
P6
R4
R3
P4
P3
R1
N1
L2
K2
J2
M2
M1
L1
K1
J1
Not Bonded
(Preset to 1)
G2
F2
E2
D2
G1
F1
E1
D1
C1
A2
B2
A3
B3
B4
A4
A5
B5
A6
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
G11
H11
J10
K10
L10
M10
J11
K11
L11
M11
N11
R11
R10
R9
R8
P10
P9
P8
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
CY7C1372C (1M x 18)
Ball ID
B6
B7
A7
B8
A8
Bit#
1
2
3
4
5
Bit#
36
37
38
39
40
Ball ID
R6
P6
R4
R3
P4
6
7
8
B9
A9
B10
41
42
43
P3
R1
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
N1
9
A10
44
10
A11
45
11
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
D11
E11
F11
46
12
47
13
48
M1
14
49
L1
15
16
17
50
51
52
K1
J1
Not Bonded
(Preset to 1)
G2
F2
E2
D2
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
A2
18
19
20
21
22
G11
H11
J10
K10
L10
53
54
55
56
57
23
M10
58
24
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
R11
R10
R9
59
25
60
26
61
27
62
28
63
B2
29
30
31
64
65
66
A3
B3
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
A4
B5
A6
32
R8
67
33
34
35
P10
P9
P8
68
69
70
CY7C1372C (1M x 18)
Ball ID
Bit#
Bit#
Ball ID
相關(guān)PDF資料
PDF描述
CY7C1372C 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-167AC 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-167AI 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250BZI 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1370D-225BGC 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1370CV25-133AC 制造商:Cypress Semiconductor 功能描述:16MB (512KX36) 2.5V NOBL-PIPE SRAM - Bulk
CY7C1370CV25-167AC 制造商:Cypress Semiconductor 功能描述:
CY7C1370CV25167BZC 制造商:Cypress Semiconductor 功能描述:
CY7C1370CV25-167BZI 制造商:Cypress Semiconductor 功能描述:
CY7C1370D-167AXC 功能描述:靜態(tài)隨機(jī)存取存儲器 512Kx36 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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