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參數(shù)資料
| 型號(hào)： | CY7C1370C-250BZI |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| 中文描述： | 512K X 36 ZBT SRAM, 2.6 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 |
| 文件頁(yè)數(shù)： | 16/27頁(yè) |
| 文件大小： | 704K |
| 代理商： | CY7C1370C-250BZI |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)當(dāng)前第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)
CY7C1370C
CY7C1372C
Document #: 38-05233 Rev. *D
Page 16 of 27
119-ball BGA Boundary Scan Orde
r
CY7C1370C (512K x 36)
Ball ID
K4
H4
M4
F4
B4
A4
G4
C6
A6
D6
D7
E6
G6
H7
E7
F6
G7
Bit#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Bit#
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Ball ID
P4
N4
R6
T5
T3
R2
R3
P2
P1
N2
L2
K1
N1
M2
L1
K2
Not Bonded
(Preset to 1)
H1
G2
E2
D1
H2
G1
F2
E1
D2
A5
A3
E4
B2
L3
G3
G5
L5
B6
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
H6
T7
K7
L6
N6
P7
K6
L7
M6
N7
P6
B5
B3
C5
C3
C2
A2
T4
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
CY7C1372C (1M x 18)
Ball ID
K4
H4
M4
F4
B4
A4
G4
Bit#
1
2
3
4
5
6
7
Bit#
37
38
39
40
36
41
42
Ball ID
N4
R6
T5
T3
P4
R2
R3
8
C6
43
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
P2
9
A6
44
10
T6
45
11
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
D6
E7
F6
G7
46
12
47
13
48
N1
14
15
16
17
49
50
51
52
M2
L1
K2
Not Bonded
(Preset to 1)
H1
G2
E2
D1
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
18
19
20
21
22
H6
T7
K7
L6
N6
53
54
55
56
57
23
P7
58
24
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
B5
B3
C5
59
25
60
26
61
Not Bonded
(Preset to 0)
27
62
A5
28
63
A3
29
30
31
64
65
66
E4
B2
Not Bonded
(Preset to 0)
G3
Not Bonded
(Preset to 0)
L5
B6
32
33
C3
C2
67
68
34
35
A2
T2
69
70
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CY7C1372C | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1372C-167AC | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1372C-167AI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1372C-250BZI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370D-225BGC | 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1370CV25-133AC | 制造商:Cypress Semiconductor 功能描述:16MB (512KX36) 2.5V NOBL-PIPE SRAM - Bulk |
| CY7C1370CV25-167AC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370CV25167BZC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370CV25-167BZI | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370D-167AXC | 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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