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參數(shù)資料
| 型號： | CY7C1370C-167BGC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| 中文描述： | 512K X 36 ZBT SRAM, 3.4 ns, PBGA119 |
| 封裝： | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 |
| 文件頁數(shù)： | 16/27頁 |
| 文件大?。?/td> | 704K |
| 代理商： | CY7C1370C-167BGC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁當(dāng)前第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁
CY7C1370C
CY7C1372C
Document #: 38-05233 Rev. *D
Page 16 of 27
119-ball BGA Boundary Scan Orde
r
CY7C1370C (512K x 36)
Ball ID
K4
H4
M4
F4
B4
A4
G4
C6
A6
D6
D7
E6
G6
H7
E7
F6
G7
Bit#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Bit#
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Ball ID
P4
N4
R6
T5
T3
R2
R3
P2
P1
N2
L2
K1
N1
M2
L1
K2
Not Bonded
(Preset to 1)
H1
G2
E2
D1
H2
G1
F2
E1
D2
A5
A3
E4
B2
L3
G3
G5
L5
B6
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
H6
T7
K7
L6
N6
P7
K6
L7
M6
N7
P6
B5
B3
C5
C3
C2
A2
T4
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
CY7C1372C (1M x 18)
Ball ID
K4
H4
M4
F4
B4
A4
G4
Bit#
1
2
3
4
5
6
7
Bit#
37
38
39
40
36
41
42
Ball ID
N4
R6
T5
T3
P4
R2
R3
8
C6
43
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
P2
9
A6
44
10
T6
45
11
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
D6
E7
F6
G7
46
12
47
13
48
N1
14
15
16
17
49
50
51
52
M2
L1
K2
Not Bonded
(Preset to 1)
H1
G2
E2
D1
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
18
19
20
21
22
H6
T7
K7
L6
N6
53
54
55
56
57
23
P7
58
24
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
B5
B3
C5
59
25
60
26
61
Not Bonded
(Preset to 0)
27
62
A5
28
63
A3
29
30
31
64
65
66
E4
B2
Not Bonded
(Preset to 0)
G3
Not Bonded
(Preset to 0)
L5
B6
32
33
C3
C2
67
68
34
35
A2
T2
69
70
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CY7C1370C-167BGI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-167BZC | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-167BZI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-200AC | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-200AI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1370C-167BGI | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370C167BZC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370C-200BGC | 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Single 3.3V 18M-Bit 512K x 36 3ns 119-Pin BGA |
| CY7C1370C-200BZI | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370CV25-133AC | 制造商:Cypress Semiconductor 功能描述:16MB (512KX36) 2.5V NOBL-PIPE SRAM - Bulk |
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