參數(shù)資料
型號(hào): CY7C1354C-166BGC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
中文描述: 256K X 36 ZBT SRAM, 3.5 ns, PBGA119
封裝: 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
文件頁數(shù): 19/28頁
文件大?。?/td> 467K
代理商: CY7C1354C-166BGC
CY7C1354C
CY7C1356C
Document #: 38-05538 Rev. *G
Page 19 of 28
Switching Characteristics
Over the Operating Range
[18, 19]
Parameter
t
Power[17]
Clock
t
CYC
F
MAX
t
CH
t
CL
t
EOV
t
CLZ
Output Times
t
CO
t
EOV
t
DOH
t
CHZ
t
CLZ
t
EOHZ
t
EOLZ
Set-up Times
t
AS
t
DS
t
CENS
t
WES
t
ALS
t
CES
Hold Times
t
AH
t
DH
t
CENH
t
WEH
t
ALH
t
CEH
Description
–250
–200
–166
Unit
ms
Min.
1
Max.
Min.
1
Max.
Min.
1
Max.
V
CC
(typical) to the First Access Read or Write
Clock Cycle Time
Maximum Operating Frequency
Clock HIGH
Clock LOW
OE LOW to Output Valid
Clock to Low-Z
[20, 21, 22]
4.0
5
6
ns
MHz
ns
ns
ns
ns
250
200
166
1.8
1.8
2.0
2.0
2.4
2.4
2.8
3.2
3.5
1.25
1.5
1.5
Data Output Valid after CLK Rise
OE LOW to Output Valid
Data Output Hold after CLK Rise
Clock to High-Z
[20, 21, 22]
Clock to Low-Z
[20, 21, 22]
OE HIGH to Output High-Z
[20, 21, 22]
OE LOW to Output Low-Z
[20, 21, 22]
2.8
2.8
3.2
3.2
3.5
3.5
ns
ns
ns
ns
ns
ns
ns
1.25
1.25
1.25
1.5
1.5
1.5
1.5
1.5
1.5
2.8
3.2
3.5
2.8
3.2
3.5
0
0
0
Address Set-up before CLK Rise
Data Input Set-up before CLK Rise
CEN Set-up before CLK Rise
1.4
1.4
1.4
1.4
1.4
1.4
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
ns
ns
ns
ns
ns
ns
WE, BW
x
Set-up before CLK Rise
ADV/LD Set-up before CLK Rise
Chip Select Set-up
Address Hold after CLK Rise
Data Input Hold after CLK Rise
CEN Hold after CLK Rise
WE, BW
x
Hold after CLK Rise
ADV/LD Hold after CLK Rise
Chip Select Hold after CLK Rise
0.4
0.4
0.4
0.4
0.4
0.4
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
ns
ns
ns
ns
Notes:
17.This part has a voltage regulator internally; t
power
is the time power needs to be supplied above V
DD
minimum initially, before a Read or Write operation can be
initiated.
18.Timing reference level is 1.5V when V
= 3.3V and is 1.25V when V
DDQ
= 2.5V.
19.Test conditions shown in (a) of AC Test Loads unless otherwise noted.
20.t
, t
, t
, and t
are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.
21.At any given voltage and temperature, t
is less than t
and t
is less than t
to eliminate bus contention between SRAMs when sharing the same
data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed
to achieve High-Z prior to Low-Z under the same system conditions.
22.This parameter is sampled and not 100% tested.
[+] Feedback
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CY7C1354C-166BGCMG 制造商:Cypress Semiconductor 功能描述:
CY7C1354C-166BGCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx36 3.3V NoBL Sync PL COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1354C-166BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx36 3.3V NoBL Sync PL COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1354C-166BZCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx36 3.3V NoBL Sync PL COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1354C-167AXC 功能描述:IC SRAM 9MBIT 167MHZ 100LQFP RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:NoBL™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:移動(dòng) SDRAM 存儲(chǔ)容量:256M(8Mx32) 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱:557-1327-2