參數(shù)資料
型號： CY7C0832AV
廠商： Cypress Semiconductor Corp.
英文描述： FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM(FLEx18 3.3V 64K/128K x 36和128K/256K x 18同步雙端口RAM)
中文描述： FLEx18 3.3 64K/128K × 36和128K/256K × 18同步雙口RAM（FLEx18 3.3 64K/128K × 36和128K/256K × 18同步雙端口RAM）的
文件頁數(shù)： 11/28頁
文件大?。?/td> 775K
代理商： CY7C0832AV
CY7C0837AV
CY7C0830AV/CY7C0831AV
CY7C0832AV/CY7C0833AV
Document #: 38-06059 Rev. *Q
Page 11 of 28
Table 4. Identification Register Definitions
Instruction Field
Revision Number (31:28)
Cypress Device ID
(27:12)
Value
Description
0h
C090h
C091h
C093h
C094h
034h
1
Reserved for version number.
Defines Cypress part number for CY7C0832AV
Defines Cypress part number for CY7C0831AV
Defines Cypress part number for CY7C0830AV
Defines Cypress part number for CY7C0837AV.
Allows unique identification of the DP family device vendor.
Indicates the presence of an ID register.
Cypress JEDEC ID (11:1)
ID Register Presence (0)
Table 5. Scan Registers Sizes
Register Name
Instruction
Bypass
Identification
Boundary Scan
Bit Size
4
1
32
n
[21]
Table 6. Instruction Identification Codes
Instruction
EXTEST
BYPASS
IDCODE
HIGHZ
CLAMP
SAMPLE/PRELOAD
NBSRST
RESERVED
Code
Description
0000
1111
1011
0111
0100
1000
1100
All other codes
Captures the Input/Output ring contents. Places the BSR between the TDI and TDO.
Places the BYR between TDI and TDO.
Loads the IDR with the vendor ID code and places the register between TDI and TDO.
Places BYR between TDI and TDO. Forces all device output drivers to a High-Z state.
Controls boundary to 1/0. Places BYR between TDI and TDO.
Captures the input/output ring contents. Places BSR between TDI and TDO.
Resets the non-boundary scan logic. Places BYR between TDI and TDO.
Other combinations are reserved. Do not use other than the above.
Notes:
21.See details in the device BSDL file.
D2
TDO
TDI
D1
TDO
TDI
TDI
TDO
Figure 3. Scan Chain for 9Mb Device
相關(guān)PDF資料
PDF描述
CY7C0833AV FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM(FLEx18 3.3V 64K/128K x 36和128K/256K x 18同步雙端口RAM)
CY7C0837AV FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM(FLEx18 3.3V 64K/128K x 36和128K/256K x 18同步雙端口RAM)
CY7C0851V FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM(FLEx36TM 3.3V 32K/64K/128K/256K x 36同步雙端口RAM)
CY7C0852V FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
CY7C0850V FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C0832AV-133AC 制造商:Cypress Semiconductor 功能描述:SRAM SYNC DUAL 3.3V 4.5MBIT 256KX18 4.4NS 120TQFP - Trays
CY7C0832AV-133AI 制造商:Cypress Semiconductor 功能描述:SRAM SYNC DUAL 3.3V 4.5MBIT 256KX18 4.4NS 120TQFP - Trays
CY7C0832AV-133AXC 功能描述:靜態(tài)隨機存取存儲器 Flex18 4M Sync Dual-Port RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C0832AV-133AXI 功能描述:靜態(tài)隨機存取存儲器 4MB (256Kx18) 3.3v 133MHz Synch 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C0832AV-133BBC 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 4.4ns 144-Pin FBGA 制造商:Rochester Electronics LLC 功能描述:- Bulk
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*