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參數(shù)資料
| 型號(hào)： | CY28329ZCT |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | XO, clock |
| 英文描述： | FAN, 80X80X25MM, 12VDC; Series:Flight LT; Flow rate, imperial:38cu.ft/min; Length / Height, external:80mm; Width, external:80mm; Depth, external:25mm; Power consumption:3W; Noise:34.4dB; Voltage, supply DC:12V dc; Approval RoHS Compliant: Yes |
| 中文描述： | 133 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO56 |
| 封裝： | 6 X 12 MM, MO-153, TSSOP2-56 |
| 文件頁(yè)數(shù)： | 7/17頁(yè) |
| 文件大?。?/td> | 290K |
| 代理商： | CY28329ZCT |
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CY28329
Document #: 38-07040 Rev. *E
Page 7 of 17
Absolute Maximum Conditions
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Supply Voltage..................................................–0.5 to +7.0V
Input Voltage............................................–0.5V to V
DD
+ 0.5
Storage Temperature (Non-Condensing).... –65°C to +150°C
Max. Soldering Temperature (10 sec.) ..................... +260°C
Junction Temperature............................................... +150°C
Package Power Dissipation..............................................1W
Static Discharge Voltage.........................................................
(per MIL-STD-883, Method 3015) ............................> 2000V
Operating Conditions
over which electrical parameters are guaranteed
[7]
Parameter
Description
Min.
3.135
Max.
3.465
Unit
V
V
DD_REF
, V
DD_PCI
,V
DD_CORE
,
V
DD_3V66
,
V
DD_48 MHz,
V
DD_CPU,
T
A
C
in
C
XTAL
C
L
3.3V Supply Voltages
Operating Temperature, Ambient
Input Pin Capacitance
XTAL Pin Capacitance
Max. Capacitive Load on
USBCLK, REF
PCICLK, 3V66
Reference Frequency, Oscillator Nominal Value
0
70
5
22.5
°
C
pF
pF
pF
20
30
f
(REF)
14.318
14.318
MHz
DC Electrical Specifications
Over the Operating Range
Parameter
V
IH
V
IL
V
OH
Description
Test Conditions
Min. Max. Unit
2.0
0.8
2.4
2.4
0.4
0.55
–5
5
–5
5
12.9
14.9
–29
–23
–33
–33
29
27
30
38
10
360
25
45
High-level Input Voltage
Low-level Input Voltage
High-level Output Voltage
Except Crystal Pads. Threshold voltage for crystal pads = V
DD
/2
Except Crystal Pads
USB, REF, 3V66
PCI
USB, REF, 3V66
PCI
0 < V
IN
< V
DD
0 < V
IN
< V
DD
CPU
For I
OH
=6*IRef Configuration
V
V
V
V
V
V
I
OH
= –1 mA
I
OH
= –1 mA
I
OL
= 1 mA
I
OL
= 1 mA
V
OL
Low-level Output Voltage
I
IH
I
IL
I
OH
Input High Current
Input Low Current
High-level Output Current
mA
mA
mA
Type X1, V
OH
= 0.65V
Type X1, V
OH
= 0.74V
Type 3, V
OH
= 1.00V
Type 3, V
OH
= 3.135V
Type 5, V
OH
= 1.00V
Type 5, V
OH
= 3.135V
Type 3, V
OL
= 1.95V
Type 3, V
OL
= 0.4V
Type 5, V
OL
=1.95 V
Type 5, V
OL
= 0.4V
REF, DOT, USB
3V66, DOT, PCI
I
OL
Low-level Output Current
REF, DOT, USB
mA
3V66, PCI
I
OZ
I
DD3
I
DDPD3
I
DDPD3
Note:
7. Multiple Supplies: the voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
Output Leakage Current
3.3V Power Supply Current V
DD_CORE
/V
DD3.3
= 3.465V, F
CPU
= 133 MHz
3.3V Shutdown Current
V
DD_CORE
/V
DD3.3
= 3.465V and @ IREF = 2.32 mA
3.3V Shutdown Current
V
DD_CORE
/V
DD3.3
= 3.465V and @ IREF = 5.0 mA
Three-state
mA
mA
mA
mA
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