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參數(shù)資料
| 型號(hào)： | CX77304-17 |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 放大器 |
| 英文描述： | YTQ-125-01-L-Q 2MM STACK OCTOPUS AUG 22/02 HI DENSITY STACKER |
| 中文描述： | 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 9.10 X 11.60 MM, 1.50 MM HEIGHT, LEAD FREE, LEADLESS, PLASTIC, SO-16 |
| 文件頁數(shù)： | 3/15頁 |
| 文件大?。?/td> | 605K |
| 代理商： | CX77304-17 |
PA MODULE FOR TRI-BAND EGSM DCS PCS / GPRS
DATA SHEET CX77304-17
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
101943B Skyworks Proprietary and Confidential Information Products and Product Information are Subject to Change Without Notice. July 29, 2004
11
Table 4. CX77304-17 Signal Description
Pin
Name
Description
Pin
Name
Description
1
GND
Ground
9
GND
Ground
2
DCS/PCS_IN
RF input to DCS/PCS PA
10
EGSM_OUT
EGSM RF output (DC coupled)
3
GND
Ground
11
GND
Ground
4
EGSM_IN
RF input to EGSM PA
12
DCS/PCS_OUT
DCS/PCS RF output (DC coupled)
5
GND
Ground
13
GND
Ground
6
VCC1
Power supply for PA driver stages
14
APC
Analog Power Control
7
GND
Ground
15
GND
Ground
8
VCC2
Power supply for PA output stages
16
BS
Band Select
Figure 5. CX77304-17 Pin Configuration—16-Pin Leadless PAM
(Top View)
Figure 6. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77304-17 is capable of withstanding an MSL 3/240 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 240 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 240 °C for more
than 10 seconds. For details on both attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Standard J–STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel, Document Number 101568.
Electrostatic Discharge Sensitivity
The CX77304-17 is a Class I device. Figure 7 lists the
Electrostatic Discharge (ESD) immunity level for each pin of the
CX77304-17 product. The numbers in Figure 7 specify the ESD
threshold level for each pin where the I-V curve between the pin
and ground starts to show degradation. The ESD testing was
performed in compliance with MIL-STD-883E Method 3015.7
using the Human Body Model. If ESD damage threshold
magnitude is found to consistently exceed 2000 volts on a given
pin, this so is indicated. If ESD damage threshold below 2000
volts is measured for either polarity, numbers are indicated that
represent worst case values observed in product characterization.
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