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參數(shù)資料
| 型號(hào)： | CX77107-14P |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 無(wú)繩電話/電話 |
| 英文描述： | PA Module for CDMA / PCS (1850-1910 MHz) |
| 中文描述： | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, DSO10 |
| 封裝： | 4 X 4 MM, 1.50 MM, MODULE, 10 PIN |
| 文件頁(yè)數(shù)： | 5/15頁(yè) |
| 文件大?。?/td> | 1168K |
| 代理商： | CX77107-14P |
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PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
DATA SHEET CX77107
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
101782E Skyworks Proprietary Information. Products and product information are subject to change without notice. March 3, 2005
13
Figure 15 Typical Case Markings (Top View)
Figure 16. Pin Configuration (Top View)
Table 6. Pin Names and Descriptions
PIN Number
Function
Description
1
VCC1 (1)
Connect to battery or DC supply
2
RF_IN
RF Input
3
GND
Ground
4
VCONT
Control voltage
5
VREF
Reference voltage
6
GND
Ground
7
GND
Ground
8
RF_OUT
RF Output
9
GND
Ground
10
VCC2 (1)
Connect to battery or DC supply
GND PAD
GND
Ground pad on underside of package
(1)
All supply pins may be connected together at the supply.
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77107 is capable of withstanding an MSL3/240 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature
should not exceed 240 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 240 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
The CX77107 is a Class I device. Figure 17 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pin of the
CX77107 product. The numbers in Figure 17 specify the ESD
threshold level for each non-ground pin where the I-V curve
between the pin and ground starts to show degradation.
The ESD testing was performed in compliance with MIL-STD-
883E Method 3015.7 using the Human Body Model. If ESD
damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely non-
functional”. Skyworks employs most stringent criteria; fails
devices as soon as the pin begins to show any degradation on a
curve tracer. To avoid ESD damage, both latent and visible, it is
very important that the product assembly and test areas follow
the Class-1 ESD handling precautions listed in Table 7.
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