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參數(shù)資料
| 型號： | CX77304-16 |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 放大器 |
| 英文描述： | 2MM SOCKET STRIPS |
| 中文描述： | 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 9.10 X 11.60 MM, 1.50 MM HEIGHT, LEAD FREE, PLASTIC, LEADLESS, SO-16 |
| 文件頁數(shù)： | 1/18頁 |
| 文件大小： | 1089K |
| 代理商： | CX77304-16 |
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
101944B Skyworks Proprietary and Confidential Information Products and Product Information are Subject to Change Without Notice. July 28, 2004
1
DATA SHEET
CX77304-16 PA Module for Tri-Band EGSM DCS PCS / GPRS
Applications
Tri-band cellular handsets
encompassing
-
Class 4 EGSM900
-
Class 1 DCS1800
-
PCS1900, and
-
Up to Class 10 GPRS
multislot operation
Features
High efficiency
-
EGSM 55%
-
DCS 50%
-
PCS 45%
Input/output internally
matched to 50
Small outline
-
9.1 mm
× 11.6 mm
Low profile
-
1.5 mm
Low APC current
-
10
A typical
Gold plated, lead-free
contacts
Description
The CX77304-16 Power Amplifier Module (PAM) is designed in a compact form factor for tri-band
cellular handsets comprising EGSM900, DCS1800, and PCS1900 operation. It also supports Class 10
General Packet Radio Service (GPRS) multislot operation.
The PAM consists of separate Heterojunction Bipolar Transistor (HBT) PA blocks for EGSM900 and
DCS1800/PCS1900 PA bands, interface circuitry, and RF input and output ports internally matched to
50 W to reduce the number of external components. The PA blocks are fabricated on a single Gallium
Arsenide (GaAs) die. Optimized for lithium ion battery operation, both PA blocks share common power
supply pins to distribute current. Extremely low leakage current (2 A, typical) of the dual PAM
maximizes handset standby time.
The CX77304-16 also contains band-select switching circuitry to select EGSM (logic 0) and DCS/PCS
(logic 1) as determined from the Band Select (BS) signal. In the block diagram shown below, the BS
pin selects the PA output (DCS/PCS OUT or EGSM OUT) while the Analog Power Control (APC) controls
the level of output power.
A custom CMOS integrated circuit provides the internal interface circuitry including a current amplifier
that minimizes the required power control current (IAPC) to 10 A, typical. The GaAs die, the Silicon
(Si) die, and passive components are mounted on a multi-layer laminate substrate and the assembly
encapsulated with plastic overmold.
Figure 1. Functional Block Diagram
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CX77304-17 | 制造商:SKYWORKS 制造商全稱:SKYWORKS 功能描述:CX77304-17 PA Module for Tri-band EGSM DCS PCS / GPRS |
| CX77306-11P | 制造商:Cypress Semiconductor 功能描述:CX77306-11P 制造商:Skyworks Solutions Inc 功能描述:CX77306-11P |
| CX77312 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:CX77312 Product Summary|PA Modules for GSM/GPRS Handsets |
| CX77314 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:CX77314 Product Summary|PA Modules for GSM/GPRS Handsets |
| CX77315 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:CX77315 Product Summary|PA Modules for GSM/GPRS Handsets |
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