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參數(shù)資料
| 型號(hào)： | CX77105-16P |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 放大器 |
| 英文描述： | Power Amplifier Module for CDMA/AMPS (824-849 MHz) |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封裝： | 4 X 4 MM X 1.5 MM HEIGHT, LM-10, MCM, 10 PIN |
| 文件頁(yè)數(shù)： | 5/15頁(yè) |
| 文件大小： | 261K |
| 代理商： | CX77105-16P |
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POWER AMPLIFIER MODULE FOR CDMA/AMP (824–849 MHZ)
DATA SHEET CX77105
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
1017887C Skyworks Proprietary and Confidential Information Products and Product Information are Subject to Change Without Notice. January 6, 2006
13
RF_OUT
VCC2
GND
VREF
VCONT
RF_IN
GND
VCC1
GROUND PAD
1
2
3
4
5
6
7
8
9
10
101787_015
Pad layout as seen from top view looking through package.
GROUND PAD is package underside.
Figure 15. CX77105 Pin Configuration (Top View)
101787_016
CX77105-N
NNNNN.N
YYWW MX
Revision
Number
Pin 1
Identifier
Lot Number
Country Code
Manufacturing
Part Number
Week
Package
Sealed
Year
Manufactured
Figure 16. Typical Case Markings (Top View)
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77105 is capable of withstanding an MSL3/240 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 240 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 240 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
The CX77105 is a Class I device. Figure 17 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pad of the
CX77105 product. The numbers in Figure 17 specify the ESD
threshold level for each pad where the I-V curve between the pad
and ground starts to show degradation.
The ESD testing was performed in compliance with MIL-STD-
883E Method 3015.7 using the Human Body Model. If ESD
damage threshold magnitude is found to consistently exceed
2000 volts on a given pad, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
101787_017
RF OUT
> +2 kV
< –2 kV
VCC2
> +2 kV
< –2 kV
VREF
+1.6 kV
–1.4 kV
VCONT
+1.0 kV
–1.3 kV
RF IN
+2 kV
–2 kV
VCC1
+2 kV
–2 kV
1
2
4
5
6
8
GND
3
7
9
10
Figure 17. ESD Sensitivity Areas (Top View)
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pad fails the electrical
specification limits” or “the pad becomes completely non-
functional”. Skyworks employs most stringent criteria and fails
devices as soon as the pad begins to show any degradation on a
curve tracer.
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
handling precautions listed in. Table 6
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