16
FN2949.4
February 22, 2008
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage . . . . . . . . . . . GND - 0.5V to VCC + 0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Voltage Range. . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
M80C88-2 Only . . . . . . . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V
Operating Temperature Range
C80C88/-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
I80C88/-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
M80C88 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
Thermal Resistance (Typical) . . . . . . . . . . . . . . . . . . . . . .
θ
JA (
oC/W)
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
CERDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Maximum Junction Temperature
Ceramic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Plastic Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature Range . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . see link below
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing applica-
tions.
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9750 Gates
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
Electrical Specifications
VCC = 5.0V, ±10%; TA = 0°C to +70°C (C80C88, C80C88-2)
VCC = 5.0V, ±10%; TA = -40°C to +85°C (l80C88, I80C88-2)
VCC = 5.0V, ±10%; TA = -55°C to +125°C (M80C88)
SYMBOL
PARAMETER
TEST CONDITION
MIN
MAX
UNITS
VlH
Logical One Input Voltage
2.0
-
V
2.2
V
VIL
Logical Zero Input Voltage
-
0.8
V
VIHC
CLK Logical One Input Voltage
VCC - 0.8
-
V
VILC
CLK Logical Zero Input Voltage
-
0.8
V
VOH
Output High Voltage
lOH = -2.5mA
3.0
-
V
lOH = -100A
VCC - 0.4
V
VOL
Output Low Voltage
lOL = +2.5mA
-
0.4
V
II
Input Leakage Current
VIN = 0V or VCC
Pins 17 thru 19, 21 thru 23 and 33
-1.0
1.0
A
lBHH
Input Current-Bus Hold High
-40
-400
A
lBHL
Input Current-Bus Hold Low
40
400
A
IO
Output Leakage Current
-
-10.0
A
ICCSB
Standby Power Supply Current
-
500
A
ICCOP
Operating Power Supply Current
FREQ = Max, VIN = VCC or GND,
Outputs Open
-10
mA/MHz
NOTES:
1. lBHH should be measured after raising VIN to VCC and then lowering to 3.0V on the following pins 2 thru16, 26 thru 32, 34 thru 39.
2. IBHL should be measured after lowering VIN to GND and then raising to 0.8V on the following pins: 2 thru16, 35 thru 39.
3. lCCSB tested during clock high time after HALT instruction executed. VIN = VCC or GND, VCC = 5.5V, Outputs unloaded.
4. MN/MX is a strap option and should be held to VCC or GND.
5. IO should be measured by putting the pin in a high impedance state and then driving VOUT to GND on the following pins: 26-29 and 32.
Capacitance T
A = +25°C
SYMBOL
PARAMETER
TEST CONDITIONS
TYPICAL
UNITS
CIN
Input Capacitance
FREQ = 1MHz. All measurements are referenced to device GND
25
pF
COUT
Output Capacitance
FREQ = 1MHz. All measurements are referenced to device GND
25
pF
CI/O
I/O Capacitance
FREQ = 1MHz. All measurements are referenced to device GND
25
pF
80C88