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參數(shù)資料
| 型號： | CK49X-495314 |
| 廠商： | Cirrus Logic Inc |
| 文件頁數(shù)： | 3/19頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVALKIT 32BIT 600M 128PIN QFPDSP |
| 其它有關(guān)文件： | On-Chip IRC Prod Bullitin |
| 應(yīng)用說明： | Audio DSP Eval Kit Appl Note |
| 設(shè)計資源： | CS4953x4/4970X4 Designer Guide |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | DSP |
| 適用于相關(guān)產(chǎn)品： | CS495314 |
| 所含物品： | 2 個板，線纜，電源 |
| 其它名稱： | 598-1938 |
CS4953xx Data Sheet
32-bit Audio Decoder DSP Family
DS705F2
11
5.5 Thermal Data (144-pin LQFP)
5.6 Thermal Data (128-pin LQFP)
Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 %
of the top & bottom layers.
2.
Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-ounce copper covering
20 % of the top & bottom layers and 0.5-ounce copper covering 90 % of the internal power plane and ground plane
layers.
3.
To calculate the die temperature for a given power dissipation
Τ
j = Ambient Temperature + [ (Power Dissipation in Watts) *
θ
ja ]
4.
To calculate the case temperature for a given power dissipation
Τ
c =
Τ
j - [ (Power Dissipation in Watts) * ψ jt ]
Parameter
Symbol
Min
Typ
Max
Unit
Thermal Resistance (Junction to Ambient)
Two-layer Board1
Four-layer Board2
θ
ja
—
48
40
—
°C / Watt
Thermal Resistance (Junction to Top of Package)
Two-layer Board1
Four-layer Board2
ψ
jt
—
.39
.33
—
°C / Watt
Parameter
Symbol
Min
Typ
Max
Unit
Thermal Resistance (Junction to Ambient)
Two-layer Board1
Four-layer Board2
θ
ja
—
53
44
—
°C / Watt
Thermal Resistance (Junction to Top of Package)
Two-layer Board1
Four-layer Board2
ψ
jt
—
.45
.39
—
°C / Watt
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