參數(shù)資料
型號： CHP0232-PM-000T
元件分類： 放大器
英文描述： 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封裝： PM6, 6 PIN
文件頁數(shù)： 2/8頁
文件大小： 611K
代理商： CHP0232-PM-000T
3236 Scott Boulevard, Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
CHP0232-PM
Preliminary Product Information - July 2002
(2 of 8)
Parameter
Condition
Min
Typ
Max
Units
Frequency Range
824
849
MHz
Gain
Pout = 28.5 dBm
Vmode = High
28
29
dB
Vmode = Low
21
22
dB
Gain Ripple*
824-849 MHz
1.0
dB
Gain Variation
Over supply voltage
2
dB/V
Over temperature
0.03
dB/°C
Power Output
CDMA mode
+28.5
dBm
Harmonics
2nd @ Po = +28.5 dBm
-30
dBc
3rd @ Po = +28.5 dBm
-30
dBc
Noise Power in Receive Band
30 kHz bandwidth
-90
dBm
Linearity (ACPR)
CDMA mode @ +28.5 dBm Pout, 885 kHz offset
-52
-48
dBc/30kHz
+28.5 dBm Pout, 1.98 MHz offset
-60
-56
dBc/30 kHz
CDMA2K 1X** @ +28.0 dBm Pout, 885 kHz offset
-52
-48
dBc/30 kHz
CDMA2K 1X** @ +28.0 dBm Pout, 1.98 MHz offset
-61
-56
dBc/30 kHz
Noise Figure
5.0
dB
Input Return Loss
-10
dB
Efficiency
Pout = +28.5 dBm - CDMA
38
%
Positive Supply Current (Icc)
Pout CDMA (12 dBm)
105
115
mA
Pout CDMA (28.5 dBm)
535
560
mA
Quiescent Current (Iq)
No RF
75
mA
Vref Supply Current (Iref)
2.0
5.0
mA
Vref Supply Voltage (Vref)
Fixed and regulated (1.2% tolerance)
2.95
V
Vmode
Vmode = Low
0.1
0.4
V
Vmode
Vmode = High
2.85
3.0
3.15
V
Imode
Vmode = High
400
800
A
Leakage Current
Vref = 0V, Vcc = 3.5V
10
A
Electrical Characteristics
Unless otherwise specified, the following specifications are guaranteed at room temperature with collector voltage (+Vcc) = 3.5 V.
* Specifications guaranteed over the temperature range of -20°C to +70°C. ** Modulation HPSK in 1.2288 MHz, RC3 PAR = 4.7 @ 1% CCDF.
Modulation When biased as specified, the CHP0232-PM will
achieve the required adjacent channel response for the digital
system specified. Celeritek tests each product under digital
modulation to ensure correlation to customer applications.
Thermal
1. The ground pad on the backside of the CHP0232-PM must
be soldered to the ground plane.
2. All leads of the package must be soldered to the appropriate
electrical connection.
Physical Dimensions and PCB Footprint
Contact the factory for detailed information and dimensions of
HBT power module package and recommended printed circuit
board footprint.
– Continued from Page 1 –
TM
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