參數(shù)資料
型號: CGB240B
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 衰減器
英文描述: 2-Stage Bluetooth & WLAN InGaP HBT Power Amplifier
中文描述: 2400 MHz - 2500 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
封裝: PLASTIC, TSSOP-10
文件頁數(shù): 1/19頁
文件大?。?/td> 692K
代理商: CGB240B
CGB 240B
Datasheet
Description:
The CGB240B GaAs power amplifier MMIC has been
especially developed for wireless LAN applications in the
2.4 - 2.5 GHz ISM band, compliant with IEEE 802.11b
standards. The chip is also fully compliant with Bluetooth
class 1 applications and thus can be used in dual-mode
(Bluetooth/WLAN) applications, too.
While providing an effective channel power of 22dBm, the
ACPR is better than -33dB relative to the sinx/x spectral
peak of an IEEE802.11b–modulated TX signal. Each
CGB240B chip is individually tested for IP3, resulting in
guaranteed ACPR performance.
In a Bluetooth class 1 system, the CGB240B’s high power
added efficiency (up to 50%) and single positive supply
operation makes the device ideally suited for handheld
applications. The CGB240B delivers 23 dBm output power
at a supply voltage of 3.2 V, with an overall
PAE
of 50% in
saturated mode. The output power can be adjusted using
an analog control voltage (
V
CTR
). Simple external input-,
interstage-, and output matching circuits are used to adapt
to the different requirements of linearity and harmonic
suppression in various applications2-stage InGaP HBT
power amplifier for WLAN and Bluetooth applications.
Features:
Pout = +23dBm at 3.2 V
ACPR / IP3 tested to be compliant with IEEE802.11b
standard
Fully compliant with Bluetooth requirements (dual-mode
use)
Single voltage supply
Wide operating voltage range 2.0 - 5.5 V
Analog power control with four power steps
Easy external matching concept
1
5
P-TSSOP-10-2
2-Stage Bluetooth & WLAN InGaP HBT Power Amplifier
Applications:
WLAN
IEEE 802.11a
Bluetooth Class 1
Package Outline:
Pin configuration:
1 & 2:
3:
4, 5, & 10:
6:
7:
8 & 9:
11 (paddle)
Vc1
RFin
NC
Vcntrl1
Vcntro2
Vc2
GND
For More Information, Please Visit www.triquint.com
Rev 1.3, July 14th, 2003
pg. 1/20
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