- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄67392 > CBTV4020EE (NXP Semiconductors N.V.) 20-bit DDR SDRAM 2 : 1 MUX PDF資料下載
參數(shù)資料
| 型號(hào)： | CBTV4020EE |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 開關(guān) |
| 英文描述： | 20-bit DDR SDRAM 2 : 1 MUX |
| 封裝： | CBTV4020EE/G<SOT761-1 (TFBGA72)|<<http://www.nxp.com/packages/SOT761-1.html<1<Always Pb-free,; |
| 文件頁數(shù)： | 4/16頁 |
| 文件大?。?/td> | 98K |
| 代理商： | CBTV4020EE |
CBTV4020_3
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 — 4 April 2008
12 of 16
NXP Semiconductors
CBTV4020
20-bit DDR SDRAM 2 : 1 MUX
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 12) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 10 and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 12.
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CBTW28DD14ET | 14-bit bus switch-multiplexer for DDR2-DDR3 applications |
| CLRD701 | CLRD701 PEGODA Contactless smart card reader |
| CLRM701 | CLRM701 MIFARE and ICODE contactless reader module |
| CSTLA4M00G55-A0 | CERAMIC RESONATOR, 4 MHz |
| CSTLA8M00T55-B0 | CERAMIC RESONATOR, 8 MHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CBTV4020EE,518 | 功能描述:開關(guān) IC - 各種 20-BIT DDR SDRAM 2 : 1 MUX RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| CBTV4020EE,551 | 功能描述:開關(guān) IC - 各種 20-BIT DDR SDRAM 2 : 1 MUX RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| CBTV4020EE,557 | 功能描述:開關(guān) IC - 各種 20-BIT DDR SDRAM 2 : 1 MUX RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| CBTV4020EE/G,118 | 功能描述:多路器開關(guān) IC 20-BIT DDR SDRAM RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| CBTV4020EE/G-T | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 20-BIT DDR SDRAM 2 : 1 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。