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參數(shù)資料
| 型號： | CBTL01023GM |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 編、解碼器及復用、解復用 |
| 英文描述： | 3.3 V, one differential channel, 2 : 1 multiplexer-demultiplexer switch for PCI Express Gen3 |
| 封裝： | CBTL01023GM<SOT1049|<<<1<Always Pb-free,; |
| 文件頁數(shù)： | 14/14頁 |
| 文件大?。?/td> | 124K |
| 代理商： | CBTL01023GM |
CBTL01023
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 24 October 2011
9 of 14
NXP Semiconductors
CBTL01023
3.3 V, one differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen3
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| CBTL01023GM,115 | 功能描述:編碼器、解碼器、復用器和解復用器 single diff channel RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| CBTL02042A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen2 |
| CBTL02042ABQ | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen2 |
| CBTL02042ABQ,115 | 功能描述:多路器開關 IC 3.3V 2 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| CBTL02042B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen2 |
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