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參數(shù)資料
| 型號： | BXM80536GC2100F |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| 封裝： | FLIP CHIP, PGA-478 |
| 文件頁數(shù)： | 23/84頁 |
| 文件大?。?/td> | 1488K |
| 代理商： | BXM80536GC2100F |
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Datasheet
3
Contents
Introduction.................................................................................................................................... 7
Terminology .......................................................................................................................... 9
Low Power Features.................................................................................................................... 11
Clock Control and Low Power States ................................................................................. 11
Normal State .......................................................................................................... 11
AutoHALT Power-Down State ............................................................................... 11
Stop-Grant State .................................................................................................... 12
HALT/Grant Snoop State ....................................................................................... 12
Sleep State ............................................................................................................ 13
Deep Sleep State................................................................................................... 13
Enhanced Intel SpeedStep Technology ........................................................................... 14
Electrical Specifications ............................................................................................................. 17
Power and Ground Pins...................................................................................................... 17
FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 17
Voltage Identification .......................................................................................................... 17
Signal Terminations and Unused Pins................................................................................ 19
FSB Signal Groups ............................................................................................................. 19
CMOS Signals .................................................................................................................... 20
Maximum Ratings ............................................................................................................... 21
Processor DC Specifications .............................................................................................. 21
Package Mechanical Specifications and Pin Information ....................................................... 47
Alphabetical Signals Reference .......................................................................................... 70
Thermal Specifications and Design Considerations................................................................ 77
Thermal Specifications .......................................................................................................80
Thermal Diode ....................................................................................................... 80
Thermal Diode Offset............................................................................................. 81
Intel Thermal Monitor........................................................................................... 82
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