參數(shù)資料
型號： BXM80526B450256
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 450 MHz, MICROPROCESSOR, CPGA495
封裝： MICRO PGA-495
文件頁數(shù)： 56/84頁
文件大?。?/td> 450K
代理商： BXM80526B450256
Mobile Pentium III Processor in BGA2 and Micro-PGA2 Packages Datasheet
Intel Corporation
iv
Tables
Table 1. New Mobile Pentium III Processor Signals....................................................... 6
Table 2. Removed Mobile Pentium II Processor Signals ................................................ 6
Table 3. Clock State Characteristics........................................................................... 10
Table 4. Mobile Pentium III Processor CPUID............................................................. 11
Table 5. Mobile Pentium III Processor CPUID Cache and TLB Descriptors ................... 11
Table 6. System Signal Groups.................................................................................. 12
Table 7. Recommended Resistors for Open-drain Signals ........................................... 13
Table 8. Mobile Pentium III Processor Absolute Maximum Ratings............................... 17
Table 9. Power Specifications for Mobile Pentium III Processor with Intel SpeedStep
Technology................................................................................................ 18
Table 10. Power Specifications for Fixed Frequency Mobile Pentium III Processor........ 19
Table 11. GTL+ Signal Group DC Specifications ......................................................... 20
Table 12. GTL+ Bus DC Specifications....................................................................... 20
Table 13. Clock, APIC, TAP, CMOS, and Open-drain Signal Group DC Specifications .. 21
Table 14. System Bus Clock AC Specifications ........................................................... 22
Table 15. Valid Mobile Pentium III Processor Frequencies ........................................... 22
Table 16. GTL+ Signal Groups AC Specifications ....................................................... 23
Table 17. CMOS and Open-drain Signal Groups AC Specifications.............................. 23
Table 18. Reset Configuration AC Specifications ........................................................ 24
Table 19. APIC Bus Signal AC Specifications ............................................................. 24
Table 20. TAP Signal AC Specifications ..................................................................... 25
Table 21. Quick Start/Deep Sleep AC Specifications ................................................... 26
Table 22. Stop Grant/Sleep/Deep Sleep AC Specifications .......................................... 26
Table 23. Intel SpeedStep Technology AC Specifications ............................................ 26
Table 24. BCLK Signal Quality Specifications ............................................................. 34
Table 25. PICCLK Signal Quality Specifications .......................................................... 34
Table 26. GTL+ Signal Group Ringback Specification.................................................. 36
Table 27. GTL+ Signal Group Overshoot/Undershoot Tolerance at the Processor Core. 37
Table 28. Non-GTL+ Signal Group Overshoot/Undershoot Tolerance at the Processor
Core.......................................................................................................... 39
Table 29. Surface-mount BGA2 Package Specifications .............................................. 40
Table 30. Socketable Micro-PGA2 Package Specification............................................ 44
Table 31. Signal Listing in Order by Pin/Ball Number................................................... 48
Table 32. Signal Listing in Order by Signal Name........................................................ 52
Table 33. Voltage and No-Connect Pin/Ball Locations ................................................. 54
Table 34. Power Specifications for Mobile Pentium III Processor with Intel SpeedStep
Technology................................................................................................ 55
Table 35. Power Specifications for Fixed Frequency Mobile Pentium III Processor........ 56
Table 36. Thermal Diode Interface ............................................................................. 57
Table 37. Thermal Diode Specifications...................................................................... 57
Table 38. BSEL[1:0] Encoding................................................................................... 62
Table 39. Voltage Identification Encoding................................................................... 70
Table 40. Input Signals.............................................................................................. 71
Table 41. Output Signals ........................................................................................... 72
Table 42. Input/Output Signals (Single Driver)............................................................. 72
Table 43. Input/Output Signals (Multiple Driver) .......................................................... 72
Table 44. PLL Filter Inductor Recommendations ......................................................... 74
Table 45. PLL Filter Capacitor Recommendations ....................................................... 75
Table 46. PLL Filter Resistor Recommendations ......................................................... 75
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