參數(shù)資料
型號: BX805573070
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 2660 MHz, MICROPROCESSOR, CBGA775
封裝: LGA-775
文件頁數(shù): 31/102頁
文件大?。?/td> 2428K
代理商: BX805573070
Package Mechanical Specifications
34
Dual-Core Intel Xeon Processor 3000 Series Datasheet
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
Package reference with tolerances (total height, length, width, etc.)
IHS parallelism and tilt
Land dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in].
Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal/Mechanical
Design Guidelines.
相關(guān)PDF資料
PDF描述
BU-65170V3-472W 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70
BU-65170V3-502Y 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70
BU-65170V3-802K 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70
BU-65170V6-300Z 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70
BU-65170V6-410L 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70
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