參數(shù)資料
型號(hào): BX805573070
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 2660 MHz, MICROPROCESSOR, CBGA775
封裝: LGA-775
文件頁數(shù): 26/102頁
文件大?。?/td> 2428K
代理商: BX805573070
Dual-Core Intel Xeon Processor 3000 Series Datasheet
3
Contents
1Introduction ............................................................................................................ 11
Terminology ..................................................................................................... 11
Processor Terminology ............................................................................ 12
Electrical Specifications ........................................................................................... 15
Power and Ground Lands.................................................................................... 15
Voltage Identification ......................................................................................... 16
Reserved, Unused, and TESTHI Signals ................................................................ 18
DC Voltage and Current Specification ........................................................ 20
VCC Overshoot ....................................................................................... 24
FSB Signal Groups.................................................................................. 25
CMOS and Open Drain Signals ................................................................. 27
Processor DC Specifications ..................................................................... 27
GTL+ Front Side Bus Specifications ............................................. 29
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29
BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30
BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32
Package Mechanical Specifications .......................................................................... 33
Land Listing and Signal Descriptions ....................................................................... 43
Alphabetical Signals Reference ............................................................................ 66
Thermal Specifications and Design Considerations .................................................. 73
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