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參數(shù)資料
| 型號： | BX805573060 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 2400 MHz, MICROPROCESSOR, CBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 100/102頁 |
| 文件大?。?/td> | 2428K |
| 代理商： | BX805573060 |
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Dual-Core Intel Xeon Processor 3000 Series Datasheet
97
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is listed in Chapter 5. The boxed processor fan heatsink is
able to keep the processor temperature within the specifications (see Table 5-1) in
chassis that provide good thermal management. For the boxed processor fan heatsink
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable
airspace clearance for the fan heatsink. The air temperature entering the fan should be
kept below 38 C. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket
Boxed Proc PwrHeaderPlacement
B
C
R110
[4.33]
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