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參數(shù)資料
| 型號(hào)： | BX805555030P |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, MICROPROCESSOR, BGA771 |
| 封裝： | LGA-771 |
| 文件頁(yè)數(shù)： | 24/104頁(yè) |
| 文件大?。?/td> | 3690K |
| 代理商： | BX805555030P |
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Electrical Specifications
26
Dual-Core Intel Xeon Processor 5000 Series Datasheet
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processors and are based on final silicon
validation/characterization.
2.
These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See Section 2.5 for more information.
3.
The voltage specification requirements are measured across the VCC_DIE_SENSE and VSS_DIE_SENSE
lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands with a 100 MHz bandwidth
oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled
in the scope probe.
4.
The processor must not be subjected to any static VCC level that exceeds the VCC_MAX associated with any
particular current. Failure to adhere to this specification can shorten processor lifetime.
5.
ICC_MAX is specified at VCC_MAX. The processor is capable of drawing ICC_MAX for up to 10 ms. Refer to
Figure 2-2 and Figure 2-3 for further details on the average processor current draw over various time
durations.
6.
FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only.
7.
The current specified is also for HALT and Enhanced HALT State.
8.
These specifications apply to the PLL power lands VCCA, VCCIOPLL, and VSSA. See Section 2.4.2 for
details. These parameters are based on design characterization and are not tested.
9.
This specification represents the total current for GTLREF_DATA and GTLREF_ADD per core.
10. VTT must be provided via a separate voltage source and must not be connected to VCC. This specification is
measured at the land.
ICC_RESET
ICC_RESET for Dual-Core Intel Xeon
Processor 5000 series with multiple
VID (1066 MHz)
150
A
18
ICC_RESET
ICC_RESET for Dual-Core Intel Xeon
Processor 5063 (MV) with multiple
VID
115
A
18
ITT
Steady-state FSB Termination
Current
6.1
A
16
ITT_POWER-UP
Power-up FSB Termination Current
8.0
A
19
ICC_TDC
Thermal Design Current (TDC) for
Dual-Core Intel Xeon Processor
5000 series (667 MHz)
100
A
6,15
ICC_TDC
Thermal Design Current (TDC) for
Dual-Core Intel Xeon Processor
5000 series (1066 MHz)
130
A
6,15
ICC_TDC
Thermal Design Current (TDC) for
Dual-Core Intel Xeon Processor
5063 (MV)
100
A
6,15
ICC_VTTOUT
DC current that may be drawn
from VTTOUT per land
580
mA
17
ICC_VCCA
ICC for PLL power lands
120
mA
8
ICC_VCCIOPLL
ICC for PLL power lands
100
mA
8
ICC_GTLREF
ICC for GTLREF
200
A
9
ITCC
ICC during active thermal control
circuit (TCC) for Dual-Core Intel
Xeon Processor 5000 series
150
A
ITCC
ICC during active thermal control
circuit (TCC) for Dual-Core Intel
Xeon Processor 5063 (MV)
115
A
ISGNT
ICC Stop-Grant for Dual-Core Intel
Xeon Processor 5000 series (667
MHz)
50
A
7
ISGNT
ICC Stop-Grant for Dual-Core Intel
Xeon Processor 5000 series (1066
MHz)
60
A
7
ISGNT
ICC Stop-Grant for Dual-Core Intel
Xeon Processor 5063 (MV)
40
A
7
Table 2-10. Voltage and Current Specifications (Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1,13
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX805555050A S L96C | 制造商:Intel 功能描述:XEON PROCESSOR 5050 |
| BX805555060A S L96A | 制造商:Intel 功能描述:MPU Xeon 65nm 3.2GHz 771-Pin FCLGA6 |
| BX805555060P S L96A | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5060 65nm 3.2GHz 771-Pin FCLGA6 |
| BX805565120P S L9RY | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box |
| BX805565130A S LAGC | 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET |
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