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參數(shù)資料
| 型號(hào)： | BX80551PG3000FN |
| 廠商： | INTEL CORP |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | FLIP CHIP, LGA-775 |
| 文件頁(yè)數(shù)： | 105/106頁(yè) |
| 文件大?。?/td> | 2713K |
| 代理商： | BX80551PG3000FN |
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98
Datasheet
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8.1
Mechanical Specifications
8.1.1
Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Pentium D processor TMA.
The boxed processor will be shipped with an unattached TMA. Figure 8-2 shows a mechanical
representation of the boxed Pentium D processor TMA. The physical space requirements and
dimensions for the boxed processor with assembled fan heatsink are shown.
NOTE: The diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
8.1.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 1290 grams. See Chapter 3 and the
Intel Pentium D Processor and Intel Pentium Processor Extreme Edition 840 Thermal and
Mechanical Design Guidelines for details on the processor weight and heatsink requirements.
Figure 8-2. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out
Volumes
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