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參數(shù)資料
| 型號： | BX80532KC2000D |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 2000 MHz, MICROPROCESSOR, CPGA603 |
| 封裝： | PGA-603 |
| 文件頁數(shù)： | 126/129頁 |
| 文件大?。?/td> | 1640K |
| 代理商： | BX80532KC2000D |
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Intel Xeon Processor with 512 KB L2 Cache
96
Datasheet
6.1
Thermal Specifications
Table 42 specifies the thermal design power dissipation envelope for the Intel
Xeon processor
with 512 KB L2 cache. The processor power listed in Table 42 is described in thermal design
power. Analysis indicates that real applications are unlikely to cause the processor to consume the
maximum possible power consumption. Intel recommends that system thermal designs utilize the
Thermal Design Power indicated in Table 42. Thermal Design Power recommendations are chosen
through characterization of server and workstation applications on the processor.
The Thermal Monitor feature is intended to protect the processor from overheating on any high
power code that exceeds the recommendations in this table. For more details on the Thermal
Monitor feature, refer to Section 7.3. In all cases, the Thermal Monitor feature must be enabled for
the processor to be operating within specification. Table 42 also lists the minimum and maximum
processor TCASE temperature specifications. A thermal solution should be designed to ensure the
temperature of the processor never exceeds these specifications.
NOTE:
1. Intel recommends that thermal solutions be designed utilizing the Thermal Design Power values. Refer to the
Intel Xeon Processor Thermal Design Guidelines
.
2. TDP values are specified at the point on Vcc_max loadline corresponding to Icc_TDP.
3. Systems must be designed to ensure that the processor is not subjected to any static Vcc and Icc
combination wherein Vcc exceeds Vcc_max at specified Icc. Please refer to the loadline specifications in
Chapter 2.0.
Figure 38. Processor Thermal Design Power vs Electrical Projections for VID = 1.500V
Table 42. Processor Thermal Design Power
Core Frequency
Thermal Design
Power1
(W)
Minimum TCASE
(°C)
Maximum TCASE
(°C)
Notes
1.80 GHz
55
5
69
2, 3
2GHz
58
5
70
2, 3
2.20 GHz
61
5
75
2, 3
2.40 GHz
65
5
74
2, 3
2.60 GHz
71
5
74
2, 3
2.80 GHz
74
5
75
2, 3
3 GHz
85
5
73
2, 3
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| BX80532KC2000E | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2GHZ - Boxed Product (Development Kits) |
| BX80532KC2200DU | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.2GHZ 603-PIN IN - Boxed Product (Development Kits) |
| BX80532KC2400D | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits) |
| BX80532KC2400DU | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits) |
| BX80532KC2500E | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.5GHZ - Boxed Product (Development Kits) |
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