- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369560 > BUF601AU HIGH-SPEED BUFFER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | BUF601AU |
| 英文描述： | HIGH-SPEED BUFFER AMPLIFIER |
| 中文描述： | 高速緩沖放大器 |
| 文件頁數(shù)： | 10/14頁 |
| 文件大小： | 247K |
| 代理商： | BUF601AU |
10
BUF600, 601
Out
160
In
+1
R
OUT
51
R
IN
BUF600AP
C
470nF
C
2.2μF
+5V
1
5
8
C
470nF
C
2.2μF
–5V
4
Pos
Neg
GND
The buffer outputs are not current-limited or protected. If the
output is shorted to ground, high currents could arise when
the input voltage is
±
3.6V. Momentary shorts to ground (a
few seconds) should be avoided but are unlikely to cause
permanent damage.
CIRCUIT LAYOUT
The high-frequency performance of the BUF600 and BUF601
can be greatly affected by the physical layout of the printed
circuit board. The following tips are offered as suggestions,
not as absolute musts. Oscillations, ringing, poor bandwidth
and settling, and peaking are all typical problems that plague
high-speed components when they are used incorrectly.
Bypass power supplies very close to the device pins. Use
tantalum chip capacitors (approximately 2.2
μ
F); a paral-
lel 470nF ceramic chip capacitor may be added if desired.
Surface-mount types are recommended due to their low
lead inductance.
PC board traces for power lines should be wide to reduce
impedance or inductance.
Make short and low inductance traces. The entire physi-
cal circuit should be as small as possible.
Use a low-impedance ground plane on the component
side to ensure that low-impedance ground is available
throughout the layout.
Do not extend the ground plane under high-impedance
nodes sensitive to stray capacitances, such as the buffer’s
input terminals.
Sockets are not recommended, because they add signifi-
cant inductance and parasitic capacitance. If sockets must
be used, consider using zero-profile solderless sockets.
Use low-inductance and surface-mounted components.
Using all surface-mount components will offer the best
AC performance.
A resistor (100
to 250
) in series with the input of the
buffers may help to reduce peaking.
Plug-in prototype boards and wire-wrap boards will not
function well. A clean layout using RF techniques is
essential—there are no shortcuts.
FIGURE 2. Test Circuit.
IMPEDANCE MATCHING
The BUF600 and BUF601 provide power gain and isolation
between source and load when used as an active tap or
impedance matching device as illustrated in Figure 3. In this
example, there is no output matching path between the
buffer and the 75
line. Such matching is not needed when
the distant end of the cable is properly terminated, since
there is no reflected signal when the buffer isolates the
source. This technique allows the full output voltage of the
FIGURE 3. Impedance Converter.
300
BUF
75
470nF
2.2μF
+5V
1
5
8
470nF
2.2μF
–5V
4
160
75
V
I
V
O
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BUF630 | TRANSISTOR | BJT | NPN | 400V V(BR)CEO | 6A I(C) | TO-220AB |
| BUF634FKTTTE3 | 250mA HIGH-SPEED BUFFER |
| BUF634PG4 | 250mA HIGH-SPEED BUFFER |
| BUF634TG3 | 250mA HIGH-SPEED BUFFER |
| BUF634UE4 | 250mA HIGH-SPEED BUFFER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BUF602 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:High-Speed, Closed-Loop Buffer |
| BUF602ID | 功能描述:高速運算放大器 High Speed Closed Loop Buffer RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| BUF602ID | 制造商:Texas Instruments 功能描述:IC OP-AMP BUFFER 1GHZ SGL 8SOIC 制造商:Texas Instruments 功能描述:IC, OP-AMP BUFFER 1GHZ SGL 8SOIC 制造商:Texas Instruments 功能描述:IC, OP-AMP BUFFER 1GHZ SGL 8SOIC; No. of Amplifiers:2; Gain Bandwidth:1000MHz; Slew Rate:8000V/s; Supply Voltage Range: 1.4V to 6.3V; Amplifier Case Style:SOIC; No. of Pins:8; Output Current:60mA; Amplifier Output:Single Ended; ;RoHS Compliant: Yes |
| BUF602IDBVR | 功能描述:高速運算放大器 High Speed Closed Loop Buffer RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| BUF602IDBVRG4 | 功能描述:高速運算放大器 Hi Speed Closed Loop Buffer RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。