參數資料
型號: BUF16820
英文描述: 14-Channel GAMMA VOLTAGE GENERATOR with Programmable VCOM Outputs and OTP Memory
中文描述: 14通道伽瑪電壓發(fā)生器具有可編程威科姆輸出和OTP存儲器
文件頁數: 2/30頁
文件大?。?/td> 681K
代理商: BUF16820
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SBOS356A FEBRUARY 2006 REVISED OCTOBER 2006
www.ti.com
2
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
BUF16820
(1)For the most current package and ordering information see the
Package Option Addendum at the end of this document, or see
the TI web site at www.ti.com.
HTSSOP-32
DAP
BUF16820
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage, VS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage, VSD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Input Terminals, SCL, SDA, A0, LD:
Voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit(2)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction Temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating:
Human Body Model (HBM)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charged-Device Model (CDM)
Machine Model (MM)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(1)Stresses above these ratings may cause permanent damage. Exposure
to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those specified is not
supported.
(2)Short-circuit to ground.
+19V
+6V
0.5V to +6V
±
10mA
Continuous
40
°
C to +95
°
C
65
°
C to +150
°
C
+125
°
C
4kV
1kV
200V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PIN CONFIGURATION
TOP VIEW
HTSSOP
(1) NC denotes no connection.
(2) GND
D
and GND
A
are internally connected and must be at
the same voltage potential.
V
COM2
REFH
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
GND
A(2)
V
S
OUT7
OUT8
OUT9
REFH OUT
V
SD
SCL
V
COM1
REFL
REFL OUT
NC
(1)
NC
(1)
OUT14
GND
A(2)
V
S
OUT13
OUT12
OUT11
OUT10
GND
D(2)
LD
A0
SDA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PowerPAD
LeadFrame
Die Pad
Exposed on
Underside
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