參數(shù)資料
型號(hào)： BU29TA2WNVX-TR
元件分類： 固定正電壓單路輸出LDO穩(wěn)壓器
英文描述： 2.9 V FIXED POSITIVE LDO REGULATOR, PDSO4
封裝： 1.20 X 1.60 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, SSON-4
文件頁數(shù)： 17/30頁
文件大?。?/td> 1661K
代理商： BU29TA2WNVX-TR
Technical Note
24/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com
2011.01 - Rev.C
2011 ROHM Co., Ltd. All rights reserved.
●
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1
(Single-side Board)
Evaluation Board 2
(Double-side Board)
Layout of Board for
Measurement
(Unit: mm)
IC Implementation Position
Top Layer (Top View)
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Single-side board)
Glass epoxy resin (Double-side board)
Board Size
40 mm x 40 mm x 0.8 mm
Wiring Rate
Top layer
Metal (GND) wiring rate: Approx. 25%
Bottom layer
Metal (GND) wiring rate: Approx 0%
Metal (GND) wiring rate: Approx 25%
Through Hole
0 holes
Diameter 0.5 mm
12 holes
Power Dissipation
1100 mW
1250 mW
Thermal Resistance
θja=91℃/W
θja=80℃/W
40
20
40
20
40
20
40 20
40
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