參數(shù)資料
型號： BU-65843F3-320
廠商： DATA DEVICE CORP
元件分類： 微控制器/微處理器
英文描述： 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP80
封裝： 0.880 INCH, CERAMIC, QFP-80
文件頁數(shù)： 47/75頁
文件大?。?/td> 532K
代理商： BU-65843F3-320
51
Data Device Corporation
www.ddc-web.com
BU-65743/65843/65863/65864
D-06/04-0
+ 5.0V_Xcvr
10
+ 3.3V_Logic
30,51,69
Gnd_Xcvr
22, 79
Gnd_Logic
31, 50, 70
TABLE 66. POWER AND GROUND, CQFP
SIGNAL NAME
BU-65743X3/X4
BU-65843X3/X4
BU-65863X3/X4
PIN
-
10, 30, 51, 69
-
22, 79, 31, 50, 70
BU-65743X0
BU-65843X0
BU-65863X0
PIN
BU-65743X8/X9
BU-65843X8/X9
BU-65863X8/X9
PIN
+ 5.0 Volt Transceiver Power
+ 3.3V_Xcvr
-
30, 51, 69
22, 79
31, 50, 70
10
-
+3.3 Volt Transceiver Power
Logic Power
Transceiver Ground
Logic Ground
DESCRIPTION
NOTE: Logic ground and transceiver ground are NOT tied together inside the package.
3.3V_XCVR
TRANSCEIVER POWER
TABLE 67. POWER AND GROUND, BGA WITH 3.3V TRANSCEIVERS
SIGNAL NAME
DESCRIPTION
A4, A5, B4, B5, J1, J2, J3, J4, J5, K1, K2,
K3, K4, K5 , U4, U5, V4, V5
BU-65843B8
BU-65863B8
BALL
3.3V_LOGIC
LOGIC POWER
A8, A9, B8, B9, L16, L17, M16, M17, N12,
N13, P12, P13, R6, R7, T6, T7, U6, U7, V6,
V7
GND_XCVR
TRANSCEIVER GROUND (THERMAL BALLS)
D3, D4, D5, E3, E4, E5, F1, F2, F3, F4, F5,
G3, G4, G5, L3, L4, L5, M3, M4, M5, N1,
N2, N3, N4, N5, P3, P4, P5
GND_LOGIC
LOGIC GROUND
E10, E11, E12, F10, F11, F12, G10, G11,
G12, H10, H11, H12, R11, R12, R13, T11,
T12, T13, U11, U12, U13
5V_VCC_CHA
TRANSCEIVER “A” POWER
TABLE 68. POWER AND GROUND, BGA WITH 5V TRANSCEIVERS
SIGNAL NAME
DESCRIPTION
F1, F2
BU-65843B3
BU-65864B3
BALL
5V_VCC_CHB
TRANSCEIVER “B” POWER
U13, V13
5V_RAM
5V RAM (BU-65864B3 ONLY)
P4, R4
3.3V_LOGIC
LOGIC POWER
A7, L1, L2, L15, L16, M3, P7, P9, R9, V8
GND_XCVR
TRANSCEIVER GROUND (THERMAL BALLS)
D3, D4, D5, E2, E3, E4, E5,F3, F4, F5, G2,
G3, G4, G5, H3, H4, H5, P11, P12, P13,
P14, P15, R11, R12, R13, R14, R15, T11,
T12, T13, T14, T15, U12, U14
GND_LOGIC
LOGIC GROUND
E12, E13, E14, F12, F13, F14, G12, G13,
G14, H12, H13, H14
NOTE: Logic ground and transceiver ground are NOT tied together inside the package.
NOTE: Logic ground and transceiver ground ARE tied together inside the package.
相關PDF資料
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