參數(shù)資料
型號: BTS725-L1
元件分類: TVS-瞬態(tài)抑制二極管
英文描述: Transient Voltage Suppressor Diodes
中文描述: ?5.0 - 24V的。 2x60mΩ極限(可控硅)17A條示波器- 20 - 9?
文件頁數(shù): 3/14頁
文件大?。?/td> 470K
代理商: BTS725-L1
PROFET
BTS 721 L1
Data Book
606
01.07.97
Maximum Ratings
at
T
j
= 25
°
C unless otherwise specified
Parameter
Symbol
Values
Unit
Supply voltage (overvoltage protection see page 4)
Supply voltage for full short circuit protection
T
j,start
=
-40 ...+150
°
C
Load current (Short-circuit current, see page 5)
Load dump protection
2
)
V
LoadDump
=
U
A
+
V
s
,
U
A
= 13.5 V
R
I
3
)
= 2
,
t
d
= 200
ms; IN
= low or high,
each channel loaded with
R
L
=
4.7
,
Operating temperature range
Storage temperature range
Power dissipation (DC)
5
(all channels active)
Inductive load switch-off energy dissipation, single pulse
V
bb
=
12V,
T
j,start
=
150
°
C
5)
,
I
L
=
2.9
A, Z
L
=
58
mH, 0
I
L
=
4.3
A, Z
L
=
58
mH, 0
I
L
=
6.3
A, Z
L
=
58
mH, 0
see diagrams on page 10 and page 11
Electrostatic discharge capability (ESD)
(Human Body Model)
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagram page 9
V
bb
V
bb
43
34
V
V
I
L
V
Load
dump4
)
self-limited
A
V
60
T
j
T
stg
P
tot
-40 ...+150
-55 ...+150
°
C
T
a
= 25
°
C:
T
a
= 85
°
C:
3.7
1.9
W
one channel:
two parallel channels:
four parallel channels:
E
AS
0.3
0.65
1.5
J
V
ESD
1.0
kV
V
IN
I
IN
I
ST
-10 ... +16
V
±
2.0
±
5.0
mA
Thermal resistance
junction - soldering point
5),6)
junction - ambient
5)
each channel:
one channel active:
all channels active:
R
thjs
R
thja
15
41
34
K/W
2
)
Supply voltages higher than V
bb(AZ)
require an external current limit for the GND and status pins, e.g. with a
150
resistor in the GND connection and a 15 k
resistor in series with the status pin. A resistor for input
protection is integrated.
3)
R
I
= internal resistance of the load dump test pulse generator
4)
V
Load dump
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
5
)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70
μ
m thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 16
6
)
Soldering point: upper side of solder edge of device pin 15. See page 16
611
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