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參數(shù)資料
| 型號： | BTS712-N1 |
| 元件分類： | TVS-瞬態(tài)抑制二極管 |
| 英文描述： | Transient Voltage Suppressor Diodes |
| 中文描述： | ？5.0 - 34V的。 4x200mΩ極限（可控硅）第4A示波器- 20 - 9？ |
| 文件頁數(shù)： | 3/15頁 |
| 文件大?。?/td> | 193K |
| 代理商： | BTS712-N1 |
BTS 711 L1
Maximum Ratings
at T
j
= 25°C unless otherwise specified
Parameter
Symbol
Values
Unit
Semiconductor Group
3
Load current (Short-circuit current, see page 5)
Load dump protection
2
)
V
LoadDump
= U
A
+ V
s
, U
A
= 13.5 V
R
I
3
)
= 2
, t
d
= 200
ms; IN
= low or high,
each channel loaded with R
L
=
7.1
,
Operating temperature range
Storage temperature range
Power dissipation (DC)
5
(all channels active)
Inductive load switch-off energy dissipation, single pulse
V
bb
=
12V, T
j,start
=
150°C
5)
,
I
L
=
1.9
A, Z
L
=
66
mH, 0
I
L
=
2.8
A, Z
L
=
66
mH, 0
I
L
=
4.4
A, Z
L
=
66
mH, 0
see diagrams on page 9 and page 10
Electrostatic discharge capability (ESD)
(Human Body Model)
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagram page 8
I
L
V
Load dump4
)
self-limited
A
V
60
T
j
T
stg
P
tot
-40 ...+150
-55 ...+150
°C
T
a
= 25°C:
T
a
= 85°C:
3.6
1.9
W
one channel:
two parallel channels:
four parallel channels:
E
AS
150
320
800
mJ
V
ESD
1.0
kV
V
IN
I
IN
I
ST
-10 ... +16
V
±
2.0
±
5.0
mA
Thermal resistance
junction - soldering point
5),6)
junction - ambient
5)
each channel:
one channel active:
all channels active:
R
thjs
R
thja
16
44
35
K/W
2
)
Supply voltages higher than V
bb(AZ)
require an external current limit for the GND and status pins, e.g. with a
150
resistor in the GND connection and a 15 k
resistor in series with the status pin. A resistor for input
protection is integrated.
3)
R
I
= internal resistance of the load dump test pulse generator
4)
V
Load dump
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
5
)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70
μ
m thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 15
6
)
Soldering point: upper side of solder edge of device pin 15. See page 15
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